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Shenzhen Bicheng Electronics Technology Co., Ltd
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Introducing TLX-8: A High-Performance PCB Material for Advanced Electronics

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Shenzhen Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374946

Contact Person:
Miss.Sally Mao
View Contact Details

Introducing TLX-8: A High-Performance PCB Material for Advanced Electronics

Brand Name Bicheng Enterprise Limited
Model Number BIC-0303-V3.03
Certification UL
Place of Origin CHINA
Minimum Order Quantity 1 PIECE
Price USD2 .99-7.99 per piece
Payment Terms T/T,Paypal
Supply Ability 50000 PIECE PER MONTH
Delivery Time 8-9 WORKING DAY
Packaging Details VACUUM
Board Material Polyimide 12.5μm + 0.2mm polyimide stiffener
Board Thickness 0.15 mm
Surface/Inner layer Cu thickness 35 µm
Surface Finish Immersion Gold
Coverlay Colour Yellow
Color of Silkscreen White
Function 100% Pass electrical test
Number of Layers 2
Detailed Product Description

Introduction:
Welcome to the next generation of high-performance PCB materials. We proudly present TLX-8, a game-changing solution designed to revolutionize the world of advanced electronics. With its outstanding properties and unwavering reliability, TLX-8 sets new standards in the industry, empowering cutting-edge electronic applications.

 

Unraveling Unparalleled Dielectric Prowess:
TLX-8 emerges as the undisputed champion of dielectric materials, offering an unparalleled DK (dielectric constant) of 2.55 at 10 GHz. This remarkable attribute ensures swift and efficient signal transmission. Equally impressive is its meager Df (dissipation factor) of 0.0012 at 1.9 GHz and 0.0017 at 10 GHz, minimizing signal loss and elevating electrical performance to unprecedented heights.

 

Unyielding Mechanical Fortitude:
Prepare to be amazed by the resolute strength of TLX-8. Flexural strength becomes its superpower, flexing its muscle at a staggering 28,900 psi (approximately 199.6 MPa) in the machine direction (MD) and 20,600 psi (approximately 142.1 MPa) in the cross-direction (CD). Brace yourself for the tensile strength of 35,600 psi (approximately 245.3 MPa) in the MD and 27,500 psi (approximately 189.6 MPa) in the CD.

 

Uncompromising Resilience:
TLX-8 revels in its ability to withstand and endure. Exhibiting an elongation at break of 3.94% in both the MD and CD directions, it refuses to yield under pressure. Encapsulating this tenacity is its Young's Modulus, a remarkable 980 kpsi (approximately 6,758 MPa) in the MD and 1,200 kpsi (approximately 8,274 MPa) in the CD, truly epitomizing stability and unyielding strength.

 

Thermal and Electrical Brilliance:
Behold TLX-8's thermal mastery, as it dissipates heat with unparalleled finesse. With a thermal conductivity of just 0.19 W/M*K, it ensures optimal thermal management, a vital consideration in high-power applications. Witness TLX-8's unwavering dimensional stability, barely flinching under varying thermal stress conditions, with minimal fluctuations in mils/inch (mm/M) in both the MD and CD.

 

Reliability and Safety Uncompromised:
TLX-8 stands tall in the realm of reliability, boasting a dielectric breakdown strength surpassing 45 kV. This impenetrable barrier protects against electrical breakdown, fortifying the longevity of electronic devices. Furthermore, with a moisture absorption rate of a mere 0.02%, TLX-8 remains impervious to environmental conditions that could compromise performance.

 

Igniting Innovation, Ensuring Safety:
TLX-8's UL-94 flammability rating of V-0 underscores its commitment to unwavering safety standards. With a density of 2.25 g/cm3, it offers a lightweight solution without compromising on performance, igniting innovation while keeping environmental considerations at the forefront.

 

Conclusion:
TLX-8 represents a paradigm shift in PCB materials, ushering in a new era of excellence in advanced electronics. Its unmatched dielectric properties, unwavering mechanical strength, exceptional thermal conductivity, and steadfast reliability make it the material of choice for those seeking superior performance and durability. With TLX-8, engineers and designers can push the boundaries of what's possible, forging a future where unimaginable possibilities become reality.

 

PropertyTest MethodUnitTLX-8 ValueUnitValue
DK @10 GHzIPC-650 2.5.5.3 2.55 2.55
Df @1.9 GHzIPC-650 2.5.5.5.1 0.0012 0.0012
Df @10 GHzIPC-650 2.5.5.5.1 0.0017 0.0017
Dielectric BreakdownIPC-650 2.5.6kV>45kV>45
Moisture AbsorptionIPC-650 2.6.2.1%0.02%0.02
Flexural Strength(MD)ASTM D 709psi28,900N/mm2 
Flexural Strength(CD)ASTM D 709psi20,600N/mm2 
Tensile Strength(MD)ASTM D 902psi35,600N/mm2 
Tensile Strength(CD)ASTM D 902psi27,500N/mm2 
Elongation at Break(MD)ASTM D 902%3.94%3.94
Elongation at Break(CD)ASTM D 902%3.92%3.92
Young's Modulus(MD)ASTM D 902kpsi980N/mm2 
Young's Modulus(CD)ASTM D 902kpsi1,200N/mm2 
Young's Modulus(MD)ASTM D 3039kpsi1,630N/mm2 
Poisson's RatioASTM D 3039 0.135N/mm 
Peel Stength(1 oz.ed)IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)Ibs./linear inch15N/mm 
Peel Stength(1 oz.RTF)IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)Ibs./linear inch17N/mm 
Peel Stength(½ oz.ed)IPC-650 2.4.8.3(Elevated Temp.)Ibs./linear inch14N/mm 
Peel Stength(½ oz.ed)IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)Ibs./linear inch11N/mm 
Peel Stength(1 oz.rolled)IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)Ibs./linear inch13N/mm2.1
Dimensional Stability(MD)IPC-650 2.4.39 Sec.5.5(After Bake.)mils/in.0.06mm/M 
Dimensional Stability(CD)IPC-650 2.4.39 Sec.5.4(After Bake.)mils/in.0.08mm/M 
Dimensional Stability(MD)IPC-650 2.4.39 Sec.5.5(Thermal Stress.)mils/in.0.09mm/M 
Dimensional Stability(CD)IPC-650 2.4.39 Sec.5.5(Thermal Stress.)mils/in.0.1mm/M 
Surface ResistivityIPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.)Mohm6.605 x 108Mohm6.605 x 108
Surface ResistivityIPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.)Mohm3.550 x 106Mohm3.550 x 106
Volume ResistivityIPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.)Mohm/cm1.110 x 1010Mohm/cm1.110 x 1010
Volume ResistivityIPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.)Mohm/cm1.046 x 1010Mohm/cm1.046 x 1010
Thermal ConductivityASTM F433/ASTM 1530-06W/M*K0.19W/M*K0.19
CTE(X axis)(25-260℃)IPC-650 2.4.41/ASTM D 3386ppm/℃21ppm/℃21
CTE(Y axis)(25-260℃)IPC-650 2.4.41/ASTM D 3386ppm/℃23ppm/℃23
CTE(Z axis)(25-260℃)IPC-650 2.4.41/ASTM D 3386ppm/℃215ppm/℃215
Density(Specific Gravity)ASTM D 792g/cm32.25g/cm32.25
Td(2% Weight Loss)IPC-650 2.4.24.6(TGA)℃535℃ 
Td(5% Weight Loss)IPC-650 2.4.24.6(TGA)℃553℃ 
Flammability RatingUL-94 V-0 V-0
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