Shenzhen Bicheng Electronics Technology Co., Ltd: RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203 TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450,

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Rogers 5880 PCB RT/duroid 5880 High Frequency PCB

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Shenzhen Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374946

Contact Person:
Miss.Sally Mao View Contact Details

Rogers 5880 PCB RT/duroid 5880 High Frequency PCB

Brand Name	Bicheng Technologies Limited
Model Number	BIC-93xx-V1.33
Certification	UL
Place of Origin	China
Minimum Order Quantity	1
Price	USD 2.88-6.99 per piece
Payment Terms	T/T, Paypal
Supply Ability	45000 pieces per month
Delivery Time	4-5 working days
Packaging Details	Vacuum
Number of Layers	2 Layer, Multilayer, Hybrid type (Mixed)
Glass Epoxy	RT/duroid 5880
Final height of PCB	10mil (0.254mm), 20mil (0.508mm) 31mil (0.787mm), 62mil (1.575mm)
Final foil external	0.5oz, 1oz, 2oz
Surface Finish	Bare copper, HASL, ENIG, Immersion tin etc.
Solder Mask Color	Green, Black, Blue, Yellow, Red etc.
Colour of Component Legend	Green, Black, Blue, Yellow, Red etc.
Test	100% Electrical Test prior shipment

Detailed Product Description

Hello everyone,

Today, we introduce high frequency PCB built on RT/duroid 5880 laminates.

RT/duroid 5880 is one of Rogers’ glass microfiber reinforced PTFE composite which is designed for exacting stripline and microstrip circuit applications.

Why do we use RT/duroid 5880?

Firstly, the randomly oriented microfibers result in exceptional dielectric constant uniformity.

Secondly, the dielectric constant of RT/duroid 5880 laminates is uniform from panel to panel and is constant over a wide frequency range.

Thirdly, its low dissipation factor extends the usefulness of RT/duroid 5880 laminates to Ku-band and above. It’s as low as 0.0004 when 1 MHz and 0.0009 when 10 GHz.

Fourthly, designed for exacting stripline and microstrip circuit applications

PCB Capability
PCB Material:	Glass microfiber reinforced PTFE composites
Designation:	RT/duroid 5880
Dielectric constant:	2.2 ±0.02 (process)
Dielectric constant:	2.2 (design)
Layer count:	2 Layer, Multilayer, Hybrid type (Mixed)
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:	10mil (0.254mm), 20mil (0.508mm)
PCB thickness:	31mil (0.787mm), 62mil (1.575mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP, etc..

RT/duroid 5880 material can be made in double layer board, multilayer board and hybrid types. The double sided boards are available in a variety of thicknesses, such as 10mil, 20mil, 31mil and 62mil.

The typical applications are microstrip and stripline circuits, commercial airline broadband antenna,radar systems, millimeter wave applications, point to point digital radio antenna etc.

The basic colour of RT/duroid 5880 PCB is black.

RT/duroid 5880 PCB also has the properties of low water absorption, excellent chemical resistance etc.

If you have any questions, please feel free to contact us.

Thank you for your reading.

Appendix: Typical Value of RT/duroid 5880

Property	RT/duroid 5880		Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	2.20 2.20±0.02 spec.		Z	N/A	C24/23/50 C24/23/50	1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign	2.2		Z	N/A	8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.0004 0.0009		Z	N/A	C24/23/50 C24/23/50	1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε	-125		Z	ppm/℃	-50℃to 150℃	IPC-TM-650 2.5.5.5
Volume Resistivity	2 x 107		Z	Mohm cm	C/96/35/90	ASTM D 257
Surface Resistivity	3 x 107		Z	Mohm	C/96/35/90	ASTM D 257
Specific Heat	0.96(0.23)		N/A	j/g/k (cal/g/c)	N/A	Calculated
Tensile Modulus	Test at 23℃	Test at 100℃	N/A	MPa(kpsi)	A	ASTM D 638
	1070(156)	450(65)	X
	860(125)	380(55)	Y
Ultimate Stress	29(4.2)	20(2.9)	X
Ultimate Stress	27(3.9)	18(2.6)	Y
Ultimate Strain	6	7.2	X	%
Ultimate Strain	4.9	5.8	Y	%
Compressive Modulus	710(103)	500(73)	X	MPa(kpsi)	A	ASTM D 695
	710(103)	500(73)	Y
	940(136)	670(97)	Z
Ultimate Stress	27(3.9)	22(3.2)	X
	29(5.3)	21(3.1)	Y
	52(7.5)	43(6.3)	Z
Ultimate Strain	8.5	8.4	X	%
	7.7	7.8	Y
	12.5	17.6	Z
Moisture Absorption	0.02		N/A	%	0.62"(1.6mm) D48/50	ASTM D 570
Thermal Conductivity	0.2		Z	W/m/k	80℃	ASTM C 518
Coefficient of Thermal Expansion	31 48 237		X Y Z	ppm/℃	0-100℃	IPC-TM-650 2.4.41
Td	500		N/A	℃ TGA	N/A	ASTM D 3850
Density	2.2		N/A	gm/cm3	N/A	ASTM D 792
Copper Peel	31.2(5.5)		N/A	Pli(N/mm)	1oz(35mm)EDC foil after solder float	IPC-TM-650 2.4.8
Flammability	V-0		N/A	N/A	N/A	UL 94
Lead-free Process Compatible	Yes		N/A	N/A	N/A	N/A

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