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Impedance Controlled FPC Board Made On Polyimide With Immersion Gold

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Shenzhen Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374946

Contact Person:
Miss.Sally Mao
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Impedance Controlled FPC Board Made On Polyimide With Immersion Gold

Brand Name Bicheng Enterprise Limited
Model Number BIC-0338-V3.38
Certification UL
Place of Origin CHINA
Minimum Order Quantity 1 PIECE
Price USD2 .99-9.99 per piece
Payment Terms T/T,Paypal
Supply Ability 50000 PIECE PER MONTH
Delivery Time 8-9 WORKING DAY
Packaging Details VACUUM
Board Material PI, PET
Board Thickness 0.03mm-3.0mm
Surface/Inner layer Cu thickness 0.5oz, 1oz, 2oz
Surface Finish Immersion Gold, Immersion Sliver, Immersion Tin
Coverlay Colour Yellow, White, Black, Green
Color of Silkscreen Yellow, White, Black, Green
Function 100% Pass electrical test
Number of Layers Single layer, Doulbe layer, Multilayer, Rigid-Flex
Detailed Product Description

Impedance Controlled FPC Board Made On Polyimide With Immersion Gold

 

Overview
A breakdown of a flexible circuit shows that it consists of 3 basic elements: copper foil, dielectric material and adhesive. Most of the manufacturing processes, i.e. imaging transfer, plating and etching, are quite similar to those used when producing plated-through boards. However, there're differences due to the thin and floppy material used in flexible circuits.

 

Bicheng Flexible Printed Circuit Capability 2019
No.SpecificationsCapabilities
1Board TypeSingle layer, Doulbe layer, Multilayer, Rigid-Flex
2Base MaterialPI, PET
3Copper Weight0.5oz, 1oz, 2oz
4LED Maximum Size250 x 5000mm
5General Maximum Size250 x 2000mm
6Board Thickness0.03mm-3.0mm
7Thickness Tolerance±0.03mm
8Mininum Drill Hole0.05mm
9Maximum Drill Hole6.5mm
10Tolerance of Drill Hole±0.025mm
11Thickness of Hole Wall≧ 8 um
12Minimum Track/Gap of Single Layer Board0.025/0.03mm
13Minimum Track/Gap of Double Layer and Multilayer Board0.03/0.040mm
14Etching Tolerance±0.02mm
15Minimum Width of Silk Legend≧ 0.125mm
16Minimum Heigh of Silk Legend≧0.75mm
17Distance from Legend to Pad≧0.15mm
18Distance from Opening Solder Mask of Drill Coverlay to Track≧0.03mm
19Distance from Opening Solder Mask of Punching Coverlay to Track≧0.03mm
20Thickness of Immersion Nickel100-300u"
21Thickness of Immersion Gold1-3u"
22Thicnkess of Immersion Tin150-400u"
23Minimum Electrical Testing Pad0.2mm
24Minimum Tolerance of Outline(Normal Steel Mould Punch)±0.1mm
25Minimum Tolerance of Outline (Precision Steel Mould Punch)±0.05mm
26Mininum Radius of Bevel Angle (Outline)0.2mm
27Stiffner MaterialPI, FR-4, 3M Adhesive, PET, Steel Sheet
28RoHsYes
29Solder Mask ColourYellow, White, Black, Green

 

Purpose of Flexible Circuits
1) To provide interconnections between printed circuit boards and other components.
2) To serve as three-dimensional substrates for the mounting of SMT components, e.g., in
photographic and video cameras.
3) To establish interconnections capable of withstanding dynamic flexing.
4) To form part of rigid-flex circuit boards.

 

Advantages
1) Flexibility
2) Volume decreases
3) Weight reduces
4) Consistency of SMD mounting
5) Reliability increases
6) Controllability of electrical design of parameters
7) Tin soldered overall on the FPC end
8) Material optional (PI, PET)
9) Low cost
10) Continuity of processing

 

Applications

Thin-film switch, capacitive touch screen / panel, keypad FPC, laser head FPC,
General purpose LED soft light strip, mobile phone built-in antenna FPC Touch screen,
Telephone receiver / earphone FPC, contact belt of inkjet printer, Toy lamp strip,
LCD module, instrument panel, flexible flat cable, display backlight etc.

 

 

 

 

 

 

 

 

 

 

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