White Advanced Technical Ceramics Insulator Plates For Electrostatic Chucks / E-Chucks
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White Advanced Technical Ceramics Insulator Plates For Electrostatic Chucks / E-Chucks
Semiconductor Ceramic E-chuck Product Description
Products : Chucks and wafer end-effectors Chucks and end-effectors are used to manipulate and carry silicon
wafers through the whole production process. The chemical inertness
of ceramics allows those components to be contamination-free for
the wafer in particular in chemical wet etching baths. ApplicationsCeramic components can be used in the following semiconductor process equipment :
Products
Mingrui can offer the following products :
Materials
The most commonly used ceramic materials are :
Ceramic End - Effectors, Endeffector, Endeffectors, Wafer Carrier, Wafer Chuck, Wafer Pick - Up Tools, Wafer Tools: NetMotion, Inc. web site Semiconductor Ceramic Arm Keywords & TagsFeatures Wafer Chuck/End Effector More details, click here Model/ Designs Properties and Application Note Properties & Application Note End - Effectors Netmotion, Alumina, serial comminication controller, Semiconductor supply, Fabs, Alumina Tubing, Microstep motor, stepper Motor Driver, Motor Controllers, Stepper Oscillator Driver, Semiconductor Fabrication Products, Clean Room Products, Clean Room, Clea htm files wh effectors
End effectors constitute the end of the robot arm which handles and moves the semiconductor wafer between positions. It’s basically the robot’s hand so it is important that it be thermally and dimensionally stable and not contaminate the chamber with particles or chemical contaminants.
Ceramic end effectors are used for their stiffness and high strength, meaning the robot arm settles to its final position faster than with aluminium. Additionally, the robot’s motion itself is faster, optimising positioning accuracy and increasing efficiency.
The ceramic material is chosen based on the deposition chemistry to which it will be exposed. For example, if plasma is used, a minimum 99.5% alumina must be used. The same consideration of gas chemistry is needed for determining the interior materials for plasma etch processes. If an anodised aluminium or alumina chamber is used with fluorinated gases or oxygen plasma then an yttria coating may be used on theanodised aluminium walls to prevent chemical attack. Yttria has superior erosion resistance and low particulation compared with alumina or thermal spray alumina coating.
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