Today most popular Notebook computers, PDA...and many other 3C
products, are ever-possible designing to make its shape and
structure become as light, thin, short and small as possible; while
this development demanding the stricter characteristics of its
coil, also resulting the conventional enamelled round wire unfitted
for the trend. This special demand for smaller-dimension and
higher-efficiency makes the fiat-shape coil become the mainstream
of the future, in response to this brand new trend, the Company
successfully developed the "Enamelled Flat Wire" for the market
FEATURES AND BENEFITS
- Different types of enamel with very good mechanical strength and
bonding properties
- Very consistent quality and dimension tolerances in line with
industry standards
- Wide range of dimensions, yarns and insulation builds available
- Very thin grades for wind turbine generators
- Improved mechanical strength, high-performance yarns and
impregnation varnishes
- Very high resistance to corona discharges for inverter applications
- High-temperature class (original Pyre-ML® enamel used) with high-
breakdown voltage
- Soft wire for easy winding
APPLICATION
1. Notebook coil.
2. Coils of printer.
3. Motors of CD driver.
4. Transformer.
5. Speaker
SPECIFICATION
Item | Characteristics | Standard | Test Result |
1 | Apperance | Smooth Equality | Smooth Equality |
2 | Conductor Diameter | Width | 1 | ±0.020 | 1.01 |
Thickness | 0.1 | ±0.009 | 0.105 |
3 | Thickness of Coating layer | Width | ≥0.007 | 0.026 |
Thickness | ≥0.030 | 0.034 |
4 | Thickness of Bonding layer | Width | ≥0.006 | 0.008 |
Thickness | ≥0.006 | 0.006 |
5 | Overall Diameter | Width | ≤1.045 | 1.044 |
Thickness | ≤0.150 | 0.145 |
6 | Pinhole | ≤3hole/m | 0 |
7 | Elongation | ≥30 % | 35% |
8 | Flexibility and Adherence | No crack | No crack |
9 | Conductor Resistance (Ω/km at 20℃) | ≤197.26 | 174.32 |
10 | Breakdown Voltage | ≥0.7KV | 1.5KV |
11 | Heat shock | No Crack | No Crack |
12 | Bond Strengh(g) | >100 | 160 |
| Conclution | | Pass |