Class 155 Self Bonding Ultra Fine Magnet Wire Varnish Enameled
Round Wire
Film or coatings will conform to the latest revisions of the
applicable standards of IEC,JIS or NEMA. Various resins are
referred in Section 2 as the basecoat and overcoat. The resins
specified may be modified. A modified resin is a resin that has
undergone a chemical change, or contains one or more additives to
enhance certain performance or application characteristics. But it
will retain the essential chemical identity of the original resin
and the coated conductor will meet all specified test requirements
of the appropriate NEMA standard (for UL approved items
Name | 0.011mm-0.02mm class 155hot wind self adhesive enameled copper wire |
Key word | Enameled copper wire |
Insulation | Polyurethane |
Thermal rating | 155degree |
Diameter of the enameled copper wire | 0.016mm |
Key word | 0.011mm-0.02mm class 155hot wind self adhesive enameled copper wire |
Characteristics | Technical requests | |
Sample 1 | Sample 2 |
Surface | Good | OK | OK |
Bare Wire Diameter | 0.016±0.001 | 0.016 | 0.016 |
Overall diameter | ≤ 0.020mm | 0.015 | 0.0195 |
Insulation thickness | Min0.001 | 0.002 | 0.002 |
Self-bonding layer thickness | Min0.001 | 0.0015 | 0.0015 |
Elongation | ≥ 6 % | 12 | 12 |
Breakdown Voltage | ≥ 120V | 248 | 260 |
Pinhole Test | ≤ 5 hole/5m | 0 | 0 |
Continuity(50v/30m) | ≤ 60 hole/5m | 0 | 0 |
Bonding Strength | ≥5 g | 10 | 10 |
Electrical Resistance | 84.29-91.37Ω/m | 86.3 | 86.3 |
Test Items | Technical Requests | Results |
Adhesive | No crack | OK |
Heat Shock | 175℃/1h no crack | OK |
Solder Ability | 390℃±5C/2S Smooth | OK |
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