Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics

Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics

A-gapfill 600 is an exceptionally soft, highly compliant gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal resistances. A-gapfill 600 is naturally tacky and requires no additional adhesive coating that can inhibit thermal performance. A-gapfill 600 is electrically insulating, stable from –45°C to 200°C and meets UL 94 V0 rating.

FEATURES

• Very high compliancy for low stress applications

• 3 W/mK thermal conductivity

• Available in thicknesses from 0.020” - 0.200” (0.5mm - 5.0mm)

• Naturally tacky, needs no further adhesive coating

APPLICATIONS

• Cooling components to the chassis or frame

• High speed mass storage drives

• RDRAM memory modules

• Heat pipe thermal solutions

• Automotive engine control units

• Telecommunications hardware
 

STANDARD THICKNESSES

0.020 to 0.200-inch (0.5 to 5.0mm)

0.020 to 0.200-inch thick material available in 0.010-inch (0.25mm) increments

Inquire about availability of material and options above 0.200-inches

STANDARD SHEET SIZES
9 x 9” (229 x 229mm). 18 x 18” (457 x 457mm). 9 x 9” only over 0.100” thickness. A-gapfill 600 can be die cut to individual shapes. Pressure sensitive adhesive is not applicable for A-gapfill 600 products.

TACKY ONE SIDE ONLY
A-gapfill 600 is naturally tacky on both sides. A-gapfill 600 can be provided tacky on one side only. This is indicated by the suffix “DC1”. This option offers good separation properties allowing the tacky side to stick to the heatsink/chasis/cold plate/etc. and the other “dry” side to release easily from the component(s).

REINFORCEMENT
Fiberglass is required in 0.020” (0.51mm) and 0.030” (0.76mm). Thicknesses of 0.040” (1.02mm) and above do not require reinforcement. Data for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application.