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STD 18um Electrolytic ED Copper Foil For Phenolic Resin Board

STD 18um Electrolytic ED Copper Foil For Phenolic Resin Board

Brand Name JIMA
Model Number EDCU-HC
Certification SGS, ISO,Reach, RoHS
Place of Origin china
Minimum Order Quantity 100kg
Price negotiation
Payment Terms T/T, L/C
Supply Ability 1000 Ton per month
Delivery Time 5-15 days
Packaging Details wooden carton
Purity 99.95%
Pinholes None
Thickness 18 mic
Elongation ≥ 1.5%
Tensile strength ≥ 160 MPa
Peel strength ≥ 1 N/mm
Length Per Roll 500 - 5000 Meter
Inter Diameter 76 Mm,152 Mm, 3 Inch,6 Inch
Detailed Product Description

STD 18um electrolytic ED copper foil for Phenolic resin board

 

specifications

 

T: 18micron

W: 5-1380 mm

L: 500-5000 M

ID: 76 mm,152 mm

 

Features:

1. Good etch ability

2. Excellent adhesion to etching resist

 

Application:

Epoxy board

 

Difference between CA copper foil and ED copper foil

 

Density: rolled copper foil higher density, the surface is relatively smooth, conducive to the production of printed circuit board after the rapid transmission of the signal, so high-frequency high-speed transmission, fine lines printed circuit board also used some calendering copper Foil.

 

Package:wooden box

 

 

 

FAQ:

 

Q1: What's your minimum order quantity?

 

A: The MOQ is 150 kg.

 

Q2: Can you supply the sample?

 

A: We can supply samples to check the quality before bulk order. But the price will be sample price not wholesale price.

 

Typical properties of Standard copper foil for phenolic resin board and epoxy board.

 

Classification

 

UnitRequirementTest Method
Foil Designation/THM123IPC-4562A
Nominal thickness/12um1/2 OZ3/4 OZ

1

OZ

2

OZ

3

OZ

IPC-4562A
Area Weightg/㎡107±4153±5228±8285±10580±15860±20

IPC-TM-650

2.2.12.2

Purity≥99.8

IPC-TM-650

2.3.15

Foil ProfileShiny side (Ra)սm≤0.4≤0.4≤0.4≤0.4≤0.4≤0.4

IPC-TM-650

2.3.17

Matte side(Rz)um≤6≤8≤10≤10≤15≤20
Tensile Strength

R.T.(23℃)

 

Mpa≥150≥220≥235≥280≥280≥280

IPC-TM-650

2.3.18

Elongation

R.T.(23℃)

 

≥2≥3≥3≥4≥4≥4

IPC-TM-650

2.3.18

SubjectΩ.g/㎡≤0.170≤0.166≤0.162≤0.162≤0.162≤0.162

IPC-TM-650

2.5.14

Peel Strength(FR-4)N/mm≥1.0≥1.3≥1.6≥1.6≥2.1≥2.1

IPC-TM-650

2.4.8

Pinholes&porosityNumberNo

IPC-TM-650

2.1.2

Anti-oxidizationR.T.(23℃)day180/
H.T.(200℃)Minutes60/

1. Standard Width,1295(±1)mm,May according to the customer request tailor.

2. We test the peel strength with FR-4(Tg140) prepreg ,please reconfirm with your pp.

Product Tags: Phenolic Resin Board Electrolytic Copper Foil   18um ED Copper Foil   STD ED Copper Foil  
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