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JIMA Copper
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Low Profile PCB Copper Foil 12um 18um 25um 35um 50um 70um 105um

Low Profile PCB Copper Foil 12um 18um 25um 35um 50um 70um 105um

Brand Name JIMA
Model Number RAPCB09
Certification SGS, ISO,Reach, RoHS
Place of Origin China
Minimum Order Quantity 50kg
Price Negotiation
Payment Terms T/T, L/C
Supply Ability 1000 Ton per month
Delivery Time 5-15 days
Packaging Details Wooden box package
Application: 3layer FCCL,EMI
Thickness 12um 18um 25um 35um 50um 70um 105um
Standard Width: 1290mm, we can cut as size requirement
ID 76mm,152mm
Lead time 7-10days
Sample Can be supply
Detailed Product Description

Low Profile Copper Foil Thickness 12um 18um 25um 35um 50um 70um 105um

 

Detail:

  • Nominal Thickness:12um 18um 25um 35um 50um 70um 105um
  • Wooden box package
  • Standard Width: 1290mm, can be cutting as size request
  • Length: Customized
  • Sample can be supply
  • Delivery: 10-20days

​Features:

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

  • Low profile for FCCL
  • High MIT
  • Excellent etchability
  • The treated foil is pink or black

​Typical Application

  • 3layer FCCL
  • EMI

Typical Properties of Low Profile Copper Foil

ClassificationUnitRequirementTest Method
Nominal thicknessum121825355070105IPC-4562A
Area Weightg/m²107±5153±7225±8285± 10435±15585± 20870±30IPC-TM-650 2.2.12.2
Purity%≥99.8IPC-TM-650 2.3.15
RoughnessShiny side (Ra)սm≤0.43IPC-TM-650 2.3.17
Matte side(Rz)um≤4.5≤5.0≤6.0≤7.0≤8.0≤12≤14
Tensile StrengthR.T.(23°C)Mpa≥207≥276IPC-TM-650 2.4.18
H.T.(180°C)≥138
ElongationR.T.(23°C)%≥4≥4≥5≥8≥10≥12≥12IPC-TM-650 2.4.18
H.T.(180°C≥4≥4≥5≥6≥8≥8≥8
ResistivityΩ.g/m²≤0.170≤0.166 ≤0.162 ≤0.162≤0.162IPC-TM-650 2.5.14
Peel Strength(FR-4)N/mm≥1.0≥1.3 ≥1.6 ≥1.6≥2.1IPC-TM-650 2.4.8
Pinholes & PorosityNumber//NoIPC-TM-650 2.1.2
Anti-oxidizationR.T.(23°C)Days//180/
H.T.(200°C)Minutes//30/

 

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

Product Tags: High Density Circuit Boards Copper Foil   25um Multilayered Pcbs Copper Foil   PCB Copper Foil 35um  
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