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Low Coarsening Reverse Treated Coppe Foil High Frequency For Fine Circuit Pattern

Low Coarsening Reverse Treated Coppe Foil High Frequency For Fine Circuit Pattern

Brand Name JIMA
Model Number EDCULP
Certification SGS, ISO,Reach, RoHS
Place of Origin china
Minimum Order Quantity 50kg
Price usd 15-20 kg
Supply Ability 1000 Ton per month
Delivery Time 7-20days
Packaging Details Wooden carton
Name Low Coarsening Reverse Treated Coppe Foil 12um 18um 35um 50um 70um For Fine Circuit Pattern
pinholes None
Thickness 12um, 18um, 35um, 50um, 70um
Feature Reverse Treated Copper Foil
application High Frequency , Ultra-high Frequency,Fine Circuit Pattern,High Tg,applying to hydrocarbon board
Detailed Product Description

 

Low Coarsening Reverse Treated Coppe Foil 12um 18um 35um 50um 70um For Fine Circuit Pattern

 

Prodent Feature

 

1.   Reverse Treated Copper Foil

2.   Low profile, with high peel strength

3.  Excellent etchability 

4.   the treated foil is pink 

5.   Shiny side treated 

 

Typical Application

 

High Frequency , Ultra-high Frequency;Fine Circuit Pattern; High Tg; applying to hydrocarbon board

 
Size :
Thickness: 12um 18um 35un 50um 70um
Width :200-1340mm,can be cutting as request

 

Typical properties of Low Coarsening Reverse Treated Coppe Foil

ClassificationUnitRequirement
Nominal thickness/12um1/2 OZ(18um)1 OZ(35um)50um 70UM
Area Weightg/㎡107±4153±5285±10435±15585±20
Purity≥99.8
RoughnessShiny side(Ra) um≤3.0≤3.0≤3.0≤3.0≤3.0
 Matte side(Rz) um≤3.0≤4.0≤6.0≤8.0≤10
Tensile StrengthR.T.(23℃)≥276≥276≥276≥276≥276
 H.T.(180℃) Mpa≥138
ElongationR.T.(23℃)≥4≥4≥8≥10≥12
 H.T.(180℃)%≥3≥4≥4≥4≥4
Peel Strength(FR-4)N/mm≥1.0≥1.2≥1.4≥1.6≥1.8
 Ibs/in≥5.7≥7.4≥8.0≥9.1≥10.2
Pinholes&porosityNumberNo
Anti-oxidizationR.T.(23℃)90
H.T.(200℃)60 Minutes40

 

Packing:  Wooden box 

 

 

 

 

Product Tags: reverse Treated edco copper foil   reverse Treated copper foil paper   Circuit edco copper foil  
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