Polyimide Film Copper Clad Laminate For FPC TCP Multi Layer Boards
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FCCL Flexible Copper Clad Laminate for FPC TCP Malti-layer boards
Description SLP flexible laminates are available in a broad range of copper clad constructions using a wide variety of base dielectrics. These laminates are available in either adhesive based or adhesiveless form. Adhesive based clads, also known as 3-layer, are made using Polyimide film and are available in sheet form with either SLP FR or LF acrylic adhesive. Also available, under the SLP Brand name, is an epoxy adhesive based 3-layer clad in roll form. Adhesiveless clads, also known as 2-layer, are available either as double-sided using a lamination based manufacturing process or single sided utilizing cast technologSpecifications.
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FAQ
Quality our principal manufacturers to ensure the high quality of products in the following aspects: 1.Certification - All of our principle manufacturers are ISO and/or U/L and SGS (RoHS) approved manufacturers with complete a quality control management system. 2. Standard- All of our principle manufacturers follow industry standards. Such as IPC standard, GB4588. 3. Global Reputation - All of our principle manufacturers have already exported their products to oversea customers and/or world-renowned brands with excellent reputations. 4. Credit and Trust - Most of our principle manufactures have had long time business relationship with us. 5. Competitive Advantage - All the products we represent have competitive advantage in the market, in terms of technology, pricing, and/or environment protection. |
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Product Tags: copper laminate sheets copper clad circuit board |
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