0.009mm High Ductility Hte Copper Foil for PCB Copper Foil
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Detailed Product Description
0.009mm High Ductility Hte Copper Foil for PCB Copper Foil |
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| Thickness | 0.009-0.09mm | Width≤520mm | ||||||
| Item | Unit | Parameter | ||||||
| Thickness | MM | 0.009 | 0.012 | 0.018 | 0.035 | 0.07 | 0.1 | |
| Grade | － | C1100 | C1100 | C1100 | C1100 | C1100 | C1100 | |
| Copper content | % | ≥99.95 | ≥99.95 | ≥99.95 | ≥99.95 | ≥99.95 | ≥99.95 | |
| Area Weight | g/㎡ | 80±2 | 107±4 | 160±5 | 311±10 | 623±19 | 890±27 | |
| Roughness | (RA) | Um | ≤0.2 | ≤0.2 | ≤0.2 | ≤0.2 | ≤0.2 | ≤0.2 |
| Tensile Strength(MP) | State normal | Mpa | ≥380 | ≥400 | ≥400 | ≥420 | ≥430 | ≥450 |
| State temper (180℃) | Mpa | ≥160 | ≥160 | ≥160 | ≥170 | ≥180 | ≥190 | |
| Elongation(%) | State normal | % | ≥0.8 | ≥1.0 | ≥1.2 | ≥1.3 | ≥1.4 | ≥1.5 |
| State temper(180℃) | % | ≥5 | ≥6 | ≥8 | ≥15 | ≥20 | ≥25 | |
| Peel strength | N/mm | ≥0.8 | ≥1.0 | ≥1.4 | ≥1.5 | ≥1.8 | ≥2.0 | |
| High temperature oxidation resistance(180℃ 1hour) | － | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified | |
Remark:Standard Width,520(±1)mm,accept customization.
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