LP Low Profile ED Copper Foil 18um 35um For Mobile Phone
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LP Low Profile ED Copper Foil 18um 35um For Mobile Phone
Matte side treatment low profile foil in back/red. Features: 1. the treated foil in gray or red 2. High profile with properties of LP-S-B/R suitable for FCCL 3. Grain structure of copper foil leads to high flexibility 4. Excellent etching performance 5. low profile enables to make fine circuit pattern Application: 1. Casting and lamination type FCCL 2. Super fine pattern FPC 3. Chip on flex (COF) for LED
Typical properties of LP-S-B/R ED electrolytic copper foil(for FPC or inner layer of HDI)
1.Standard Width 520mm,max width 1295(±1)mm,May according to the customer request tailor. We test the peel strength with PI ,please reconfirm with your pp.
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