1.0mm Thickness 0.5oz Turnkey PCB Assembly Min 0201 Chips

Fast Turnkey PCB Assembly Schematic Diagram Precision Min 0201 Chips PCBA
 

Production Capability

SHINELINK has invested in the best equipment, environment and staff training. We have a production capability for standard and HDI ,Rigid, RF and high frequency PCBs, together with through hole and min 0201 chips, 0.2mm pitch BGA balls SMD soldering, in small batch, mid volume and high volume quantities.

SHINELINK, your single point of contact for all of your raw materials, parts, pcb assembly and finished product assembly, also offers

1. Contract Manufacturing

2. Engineering Services

3. PCB Design & Assembly

4. Product Design

5. Prototyping

6. Cable and Wire Assemblies

7. Plastics and Molds

Shinelink kinds PCBA Products

 
Feature
 

 
PCB Assembly Capabilities
 

 
 
Advantage
 
1. ISO& UL certified third-party testing and high-quality technical service team.
2. Available and immediate delivery.
3. Producing capacity: 20,000sq meter/month.
4. Competitive price with no MOQ.

FAQ:

1. How do Shinelink keep your price competitive?

Over the last decade, prices of many raw materials (e.g. copper, chemicals) had doubled, tripled or quadrupled; Chinese currency RMB had appreciated 31% over US dollar; And our labor cost also increased significantly.

However, Shinelink have kept our pricing steady. This owns entirely to our innovations in reducing cost, avoiding wastes and improving efficiency. Our prices are very competitive in the industry at the same quality level.

We believe in a win-win partnership with our customers. Our partnership will be mutually beneficial if we can provide you an edgeon cost and quality.

2. What kinds of boards can Shinelink process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

3. What data are needed for PCB & PCBA production?

BOM (Bill of Materials) with reference designators: component description, manufacturer’s name and part number.
PCB Gerber files.
PCB fabrication drawing and PCBA assembly drawing.
Test procedures.
Any mechanical restrictions such as assembly height requirements.

4. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.