High Motion Precision 5μm Micro Focus BGA QFN Electronics X-ray Equipment AX7900 Unicomp Quality Control

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City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:+86-755-8527-1589

Contact Person:
Mr.James Lee View Contact Details

High Motion Precision 5μm Micro Focus BGA QFN Electronics X-ray Equipment AX7900 Unicomp Quality Control

Brand Name	Unicomp
Model Number	AX7900
Certification	CE, FDA
Place of Origin	China
Minimum Order Quantity	1 set
Price	can negotiate
Payment Terms	L/C,T/T
Supply Ability	300 sets per month
Delivery Time	15 days after order confirmation
Packaging Details	Wooden Case, Waterproof, Anti-collision
Name	Unicomp X-ray Inspection Machine AX7900
Application	SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Voltage	90kV
Detector	Flat Panel Detector (FPD)
Pixel Size	84μm
Focus Spot Size	5μm
X-Ray Safety	<1μSv/h (Meets All International Standards)

Detailed Product Description

High Motion Precision 5μm Micro Focus BGA QFN Electronics X-ray Equipment AX7900

Automatic X-ray Mapping Inspection for IC Electronics Components

Advanced X-ray inspection system for internal quality assessment and counterfeit detection of electronic components.

System Overview

The AX7900 features a 90KV 5μm X-ray tube with FPD detector, multi-function workstation, and comprehensive motion control system. The system includes XY multi-axis movement with ±60° tilt motion option, Z-axis movement for magnification adjustment, and convenient target point positioning.

Key Features

90KV 5μm X-ray tube with FPD Detector
Multi-function workstation with X-Y multi-axis movement
±60° "Arc" motion capability (Optional)
Comprehensive motion controls including X/Y table, Z-axis tube/detector movement
Multi-function DXI image processing system
X/Y programming for multiple image inspection routines
Maximum loading area: 420mm x 420mm
Maximum detection area: 380mm x 380mm
Approximately 300X system magnification
BGA void/area auto-measurement with report generation

Applications

LED, SMT, BGA, CSP, Flip Chip Inspection • Semiconductor and Packaging Components • Battery Industry • Electronic Components • Auto Parts • Photovoltaic Industry • Aluminum Die Casting • Moulding Plastic • Ceramics • Other Special Industries

Technical Specifications

System Summary
Footprint	1200(W)×1285(D)×1700(H)mm
Machine Weight	1235 kg
Power Supply	220V±10%, 50/60Hz 4A
Power Consumption	0.8 kW
X-Ray Tube
Tube Type	Sealed
Max. Power	8W
Voltage	90kv
Focus Spot Size	5μm
Imaging System
Detector	Flat Panel Detector (FPD)
Pixel Size	84μm
Effective Detection Area	129*129mm
Frame Rates	30fps
Pixel Matrix	1536*1536
Geometric Magnification	52X
Software
Auto-measuring	BGA Soldering Voids Auto-measuring and Support Data/Graphic Output
Multiple Measuring Tools	Support Measuring Distance, Angle, Diameter, Polygon, PTH filling rate, etc.
CNC Mode	CNC Programmable Inspection, Easy Operation and User Friendly
Real-time Display	Real-time Displaying the Working Data of Voltage, Current, Angle, Date, etc
Navigation	Convenient Target Point Positioning System
Motion Control System
Movement Control	Joystick, Keypad & Mouse
Max. Loading Area	600*520mm
Max. Inspection Area	505*404mm
Tilt and Rotation	±25°
Industrial PC
Monitor	24'' HD Display
System OS	Windows 11 64bit
Hard disk	1TB
RAM	16GB
CPU model	Intel i7 Processor
Other Features
Energy Saving	X-Ray Auto-off when it's out of work over than 5 minutes
X-Ray Safety	<1μSv/h (Meets All International Standards)
Authority Management	Fingerprint Access Management System, and Support Password Accessing
Safety Operation	Electromagnetic Interlock, Warning Light and Real-time Radiation Leakage Monitor

* Specifications are subject to change without notice. All trademarks are the property of the system maker.

X-ray Inspection Images

Product Tags: 5μm precision BGA X-ray machine high motion micro focus X-ray equipment QFN electronics X-ray with warranty

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