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Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)

Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)

Brand Name UNICOMP
Model Number AX9100max
Certification CE, FDA
Place of Origin China
Minimum Order Quantity 1 set
Price can negotiate
Payment Terms L/C,T/T
Supply Ability 100set/montrh
Delivery Time 15 days
Packaging Details Unicomp Wood.
Voltage 130kV
Movement Control Mouse & Keyboard & Dual joystick
Max. Loading Area Φ620[mm]
Max. Inspection Area 450*600[mm]
Tilt and Rotation Rotate the swing arm up to 60°
Table Plane rotation 360°
Detailed Product Description
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)
The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including:
  • BGA/CSP/Flip Chip packaging
  • LED & optoelectronic components
  • Fuse & diode manufacturing
  • PCB & semiconductor assembly
  • Battery production
  • Small metal castings
  • Electronic connector modules & cables
  • Photovoltaic (PV) cell inspection
Application Fields
Application fields of Unicomp AX9100max X-ray Machine
Functions and Features
Functions and features of Unicomp AX9100max X-ray Machine
Inspection Image
Sample inspection image from Unicomp AX9100max X-ray Machine
Technical Parameters and Specifications
Technical specifications of Unicomp AX9100max X-ray Machine
Dimensions and Appearance
Dimensions and appearance of Unicomp AX9100max X-ray Machine
Product Tags: Unicomp AX9100max X Ray Machine   Flip-Chip BGA X Ray Machine   FCBGA electronics inspection machine  
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