Unicomp X-ray System AX9100max For Internal Defect Inspection Of Electronic Components
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Detailed Product Description
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc.
* Specifications are subject to change without notice, All trademarks are the property of the system maker.
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Product Tags: unicomp x-ray system ax9100max Internal Defect Inspection X-ray System X-ray System for Electronic Components |
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