Unicomp X-ray system AX7900 for internal defect inspection of Electronic Components

Unicomp X-Ray inspection machine AX7900 for BGA inspection of Electronic Components

FEATURES of IC Xray machine AX7900:

• 90KV 5μm X-ray tube, FPD Detector.
• Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option).
• Motion controls include X/Y table motion plus Z-axis tube and detector movement, ±60° tilt motion (option).
• Multi-function DXI image processing system.
• X/Y programming function for multiple image inspection routines
• Max. loading area 420mm x 420mm, max. detection area 380 x 380mm, with ~300X System Magnification.
• BGA void/area auto-measurement plus report generation.

Description of IC X Ray machine AX7900:

90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm x 420mm , max. detection area 380 x 380mm, with ~300X System Magnification.

APPLICATION of IC Xray machine AX7900:

• LED, SMT, BGA, CSP, Flip Chip Inspection.
• Semiconductor, Packaging components, Battery Industry.
• Electronic components, Auto parts, Photovoltaic Industry.
• Aluminum Die Casting, Moulding Plastic.
• Ceramics, Other Special Industries

Technical Specifications of AX7900

Inspection Images of IC X Ray machine AX7900: