Unicomp AX8200max X Ray Inspection Machine For Wire Harness Defects Inspection
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Unicomp AX8200max X-ray Inspection machine for Wire Harness Defects Inspection
Application Fields of BGA Xray machine AX8200max Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB,
Semiconductor, Battery Industry, Small
Technical Specifications of BGA Xray machine AX8200max
Inspection Images of BGA Xray machine AX8200max
Footprint of BGA Xray machine AX8200max
Function & Features of BGA Xray machine AX8200max 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming Automatic Positioning 4. FPD 60° Tilting Inspection 5. Fingerprint Access Management System 6. Real-time Monitoring of Radiation |
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Product Tags: Wire Defects Unicomp X Ray machine Wire Harness X ray Inspection machine 1.0 kW X ray Inspection machine |
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