Unicomp AX9100 X Ray Machine SMT PCBA BGA LED QFN Soldering Void Measurement

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Unicomp Technology

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:+86-755-8527-1589

Contact Person:
Mr.James Lee View Contact Details

Unicomp AX9100 X Ray Machine SMT PCBA BGA LED QFN Soldering Void Measurement

Brand Name	UNICOMP
Model Number	AX9100
Certification	CE, FDA
Place of Origin	China
Minimum Order Quantity	1Set
Price	can negotiate
Payment Terms	T/T, L/C
Supply Ability	300 sets per month
Delivery Time	30 days
Packaging Details	Wooden Case, Waterproof, Anti-collision
Name	X-ray Inspection Machine
Application	SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Tube Voltage	130KV
Industry	Electronics Industry
Size	1350(L)x1250(W)x1700(H)mm
X-ray Leakage	< 1uSv/h
Weight	1900kg
Power Consumption	1.6kW

Detailed Product Description

SMT PCBA BGA LED QFN Soldering void measurement by Unicomp AX9100 X Ray Machine

Applications:

● SMT, BGA, CSP, Flip Chip, LED Detection.
● Semiconductor, Packaging components, Battery Industry.
● Electronic components, Auto parts, Photovoltaic Industry.
● Aluminum Die-casting, Moulding Plastic.
● Ceramics, Other Special Industries.

Features:

● 90-130KV 7μm X-Ray tube.
● High speed & Millions pixels high resolution FPD.
● 1000X magnification, high-definition real-time image.

● One-button operation with 2.5D image display.
● Off-line programming function, navigation mode detection.
● 7 axis linkage, 70 degree tilt detection.

Item	Definition	Specs
System Parameters	Size	1350(L)x1250(W)x1700(H)mm
	Weight	1900kg
	Power	220AC/50Hz
	Power Consumption	1.6kW
X-ray Tube	Type	Closed
	Max.Voltage	130kV
	Max.Power	40W
	Spot Size	7μm
X-ray System	Intensifier	FPD
	Monitor	22 ‘’LCD
	System Magnification	1600 X
Detection Region	Max.Loading Size	Φ570mm
Detection Region	Max.Inspection Area	450mm x 450mm
X-ray Leakage		<1μSv/h

Test Images:

Product Tags: Unicomp AX9100 X Ray Machine LED QFN X Ray Machine Soldering Void X Ray Equipment

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