SMT BGA Soldering Void Measurement X-Ray Machine Microfocus 130kV
|
Detailed Product Description
130kV 7 μm Microfovus X-Ray Machine For SMT BGA Soldering Void
Measurement
Features:
● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display.
Test Images:
|
||||||||||||||||||||||||||||||||||||
Product Tags: Soldering Void Measurement X Ray Machine Microfocus X Ray Machine 130kV X Ray Machine |
Related Products
![]() |
Unicomp 180kV Microfocus X-ray Source For IGBT Substrate / Module |
![]() |
Accurate X-Ray Inspection for PCB Control X-ray Leakage 1uSv/h Voltage 0-110kV Adjustable |
![]() |
SMT IC Closed Type Tube X-Ray Machine With 5 Micron Focus Spot Unicomp AX7900 |
![]() |
Unicomp AX7900 PCBA X-Ray Machine With High Flat Panel Detector For IC Components Inspection |
![]() |
High Resolution 90kV Benchtop PCB X-Ray Machine Unicomp AX7900 For Electronic Components |
![]() |
90kV Off-Line PCB X-Ray Machine Unicomp AX7900 For IC & BGA Soldering Balls |
Email to this supplier