EMS Semiconductor Unicomp X Ray Inspection Machine Electronics BGA AX8200

EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200

The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework operation. Supported by a powerful and easy to use software interface, the AX-8200 is capable of addressing small and large volume factory requirements. (Contact us for details)

Features:

● 100KV 5μm X-ray tube, image intensifier with 2 mega pixels CCD camera.

● Motion controls include: ±60° tilt motion, X/Y table motion plus Z axis tube and detector movement.

● Multi-function DXI image processing system

● X/Y programming function for multiple image inspection routines

● Max. loading area 510mm x 420mm, max. detection area 435 x 385mm with ~300X System Magnification.
 

BGA void/area auto-measurement plus report generation.
 

Applications:

BGA , CSP , LED , Flip Chip , Semiconductor,

Battery Industry , Small Metal Casting,

Electronic Connector Module,

Aerospace Components , Photovoltaic Industry,

Other Special Industries.
 
 
 

 
 
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