China Unicomp X Ray manufacturer
Unicomp Technology
8
Home > Products > Electronics X Ray Machine >

Grey Unicomp X Ray Detection Equipment , BGA Void Inspection Machine 220AC / 50Hz

Grey Unicomp X Ray Detection Equipment , BGA Void Inspection Machine 220AC / 50Hz

Brand Name UNICOMP
Model Number LX2000
Certification CE, FDA
Place of Origin China
Minimum Order Quantity 1Set
Price can negotiate
Payment Terms T/T, L/C
Supply Ability 300 sets per month
Delivery Time 30 days
Packaging Details Wooden Case, Waterproof, Anti-collision
Color Grey
Name Electronics X Ray Machine
Application SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Max. Voltage 90kV / 100kV
Power 220AC/50Hz
Size 1600(L)x1450(W)x1600(H)mm
Detailed Product Description

BGA voids inspecting machine Electronics X ray machine for SMT manufacturer

 

 

The LX-2000 is a versatile OnLine X-ray Machine designed for automated and semi-automated analysis. In addition to the OnLine capability, the LX-2000 can also be used in a Manual mode as a process monitoring/engineering workstation.

High resolution x-ray images are generated using a closed microfocus 130kV tube with leading edge FPD (Flat Panel Display) detectors. This imaging chain combination is excellent for multiple applications including; PCBA, Semiconductor, Encapsulated Components, and Solar Cell just to name a few.

 

 

OUR SERVICE

 

1. Your inquiry will be replied in 12 hours.

 

2. Original Manufacture to customers, with competitive price.

 

3. We provide one year warranty, free training and whole life technology support.

 

4. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you,
and will give you the tracking NO. after shipment.

 

5. Well-trained and Professional after-sales service team to support you.

 

6. Manual will package with machine . It will show you how to use machine step by step.

 

7. Items are only shipped after payment is received.

 

 

Application:

 

1. BGA/CSP/FLIPS CHIP:
Bridging ,Voids,Opens,Expcessive/insufficient

 

2. QFN:Bridging,Voids,Opens,Registration

 

3. SMT Standard components:
QFP,SOT,SOIC,Chips,Connectors,Others

 

4. Semiconductor:
bond wire,die attach VOID ,MOLD,VOID

 

5. Multi-layer board(MLB):
Inner layer registration,PAD stack,blind/buried vias

Product Tags: electronics x ray system   x ray equipment  
Related Products
Email to this supplier
 
From:
Enter your Email please.
To: Unicomp Technology
Subject:
Message:
Characters Remaining: (80/3000)