Copper Circuit Board TiN Coating Machine , MF Magnetron Sputtering System

Copper Circuit Board TiN PVD Coating Machine / PVD TiN Decorations Plating on Brass Board

The PVD machine model: RTSP1215-MF is designed and developed to deposit TiN gold coating on Copper circuit board. The TiN thin film generated in high vacuum environment, which highly enhanced the uniformity and purity.

Copper Circuit Board TiN PVD Coating Machine design features:

1. 8-sides chamber with equal sizes mounting flanges, which can assemble and exchange Ion source and Sputtering cathodes or Arc cathodes flexiblely based on the coating processes demand.

2. Compact design which only occupy 20sqm;

3. Ion source for plasma cleaning pre-treatment and Ion-beam assisted deposition to enhance the film adhesion.

4. High pumping speed package and stable configuration, the magnetically suspension molecular pumps can be mounted in any direction.

Copper Circuit Board TiN PVD Coating Machine Specifications

Performance

1. Ultimate Vacuum Pressure: better than 5.0×10^-6 Torr.

2. Operating Vacuum Pressure: 1.0×10^-4 Torr.

3. Pumpingdown Time: from 1 atm to 1.0×10^-4 Torr≤ 3 minutes ( room temperature, dry, clean and empty chamber)

4. Metalizing material (sputtering + Arc evaporation): Ni, Cu, Ag, Au, Ti, Zr, Cr etc.

5. Operating Model: Full Automatically /Semi-Auto/ Manually

Structure

The vacuum coating machine contains key completed system listed below:

1. Vacuum Chamber

2. Rouhging Vacuum Pumping System (Backing Pump Package)

3. High Vacuum Pumping System ( Magnetically Suspension Molecular Pump)

4. Electrical Control and Operation System

5. Auxiliarry Facility System (Sub System)

6. Deposition System

Copper Circuit Board TiN PVD Coating Sample

Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.