DC And MF Magnetron Sputtering Coating Machine Deep Black PVD Coating Solutions

DC and MF Magnetron Sputtering Coating Machine, Deep Black PVD Coating Solutions

Magnetron Sputtering Coating

Plasma coating
Magnetron sputtering is a plasma coating process whereby sputtering material is ejected due to bombardment of ions to the target surface. The vacuum chamber of the PVD coating machine is filled with an inert gas, such as argon. By applying a high voltage, a glow discharge is created, resulting in acceleration of ions to the target surface and a plasma coating. The argon-ions will eject sputtering materials from the target surface (sputtering), resulting in a sputtered coating layer on the products in front of the target. Magnetron sputtering technology is characterized by:

• A water-cooled target, so little radiation heat is generated
• Almost any metallic target material can be sputtered without decomposition
• Non-conductive materials can be sputtered by using radio frequency (RF)
  or medium frequency (MF) power
• Oxide coatings can be sputtered (reactive sputtering)
• Excellent layer uniformity
• Very smooth sputtered coatings (no droplets)
• Cathodes (of up to 2 meter long) can be put in any position, therefore high
  flexibility of sputtering equipment design
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