PVD Functional Coatings- Gold Sputtering Thin Film Deposition System

 Gold has a bright, reddish-yellow color in its purest form. It does not oxidize in the air at room temperature, so it remains very stable under normal conditions and its electrical conductivity is constant. It is one of the most common precious metals used in finishing.

Gold is corrosion resistant, which makes it a good finish for connector pins and electrical switch contacts.

Gold plating is used in parts and components across a wide range of main industries:

1. Medical applications: body implants
2. Energy: hydrogen fuel cell Bipolar plates
3. Semiconductor: microelectronic chips
4. Aerospace & defense
5. Telecommunications and other more

ROYAL Technology supplies turnkey coating solutions for manufactures who are looking for a reliable team for long term cooperation.

Robust design, large batches, fast cycle, flexible coating processes are the basic design concepts ROYAL Team has been pursuing.

Design Advantages

1. Energy saving: compact design and molecular pumps are applied
2. High target utilization up to 40% with planar sputtering cathode
3. Sputtered Au gold film’s thickness is controllable
4. One-Touch operation system

PVD Gold sputtering deposition

1. When comes to glass, metal alloys etc. Substrates material, the bonding layer is essential to enhance substrate and Aufilm adhesion. Royal Technology has developed a range of matured coating recipes based on different applications, support our customers with professional advice.
2. The roughness (RMS – root mean square) < 40Å is expected for most of the applications. For certain scanning probe applications a lower roughness might be required, generally 1.5 ~ 4 nm.
3. Gold sputtering layer surface purity: a clean surface is required for applications that employ gold surface modifications. Depending on the PVD process used, level of vacuum in the system, original purity of the gold source (over 99.99% generally)
   
    

   Technical Specifications:

   MODEL: RTSP800

   TECHNOLOGY: DC Sputtering + Ion source (for option)

   MATERIAL: Stainless Steel

   CHAMBER SIZE: Φ800*H800mm

   CHAMBER TYPE: Cylinder, vertical, 1-door

   ROTARY RACK SYSTEM: Planetary/Central driving

   DEPOSITION MATERIAL: Gold, Aluminum, Silver, Copper, Chrome, Stainless Steel, Nickel, Titanium

   DEPOSITION SOURCE: Planar Sputtering Cathodes,

   Conventional arc cathodes for option(according to the coating process’s requirement)

   REACTIVE GAS CONTROL: MFC, 2/4 ways

   CONTROL PLC(Programmable Logic Controller) +IPC

   PUMP SYSTEM:
   SV300B – 1 set (Leybold) 300m³/hr

   Roots Pump – 1 set, 490m³/hr

   Holding Pump – 1 set, 60m³/hr

   Turbo Molecular Pump: – 1 set, 3500L/S

   POWER SUPPLY: Bias power supply: 1*24 KW

   DC sputtering power: 12KW

   Linear Ion source: 5KW

   SAFETY SYSTEM:Numerous safety interlocks to protect operators and equipment

   COOLING Recycle: Cooling Water

   HEATING: Heaters, 9KW

   POWER ELECTRICAL:
   480V/3 phases/60HZ ( USA compliant)

   460V/3 phases/50HZ ( Asia compliant)

   380V/3 phases/50HZ ( EU-CE compliant)

   FOOTPRINT: L3200*W2600*H2000mm

   TOTAL WEIGHT: 4.0 T

   CYCLE TIME: 30~40 minutes (depending on substrate material, substrate geometry and environmental conditions)

   POWER MAX: 50KW

   AVERAGE POWER CONSUMPTION (APPROX.): 20KW

Insite

Please contact us for more information, we are always open to communicate and share with you the advanced techniques.