Printed Circuit Board (PCB) Gold Plating Equipment, TiN Gold Sputtering Machine

Applications

The RTSP1215 machine is tailor-designed and made for cooper PCBs gold plating by sputtering deposition technology.

Everyone who are involved with the PCB industry knows that PCBs which have copper finishes on the surface requires a protective layer to protect it against from oxidize and deteriorate.

2 Years ago, we received a request from our customer, they were looking for a coating solution generate a fine gold and bronze colors on the copper PCBs which used for 5G SIM card, social security cards and smart cards module. We spent 6 months in R&D, over 20 times experiment to finalized the proper coating processes. In March 2020, we delivered the machine to customer’s site with a high accomplishment.

RTSP1215 plating system can deposit the metals: Au gold, Ag silver, Cu copper conductive families films; corrosion resistance metal families: Tantalum(Ta), Nickle (Ni), Chrome (Cr) etc.
compounded films: carbon-based metal films, Nitride metal films.

PVD Gold Plating Advantages

Environmentally friendly process

Much lower production cost compared with conventional Gold electroplating

Excellent Life

Film thickness and uniformity are well controlled

Widely available, more options for end user

Key Features

Multiple deposition sources for fast deposition rate

Strong vacuum pumping system for a short cycle

Anode linear ion source to improve adhesion and high density of deposited films

6 units standard planar cathodes mounting flanges

Flexible coating processes applied

Modular structure design for fast exchange of cathodes and targets

5G circuit microchip SIM card emblem isolated on white background

 
Technical Specifications

 

Model: RTSP1215

Chamber Material: SUS304

Chamber Size: Φ1200*1500mm (H)

Deposition Technology: Magnetron sputtering

Targets: Ta, Au, Ag, Ti,Cr,Zr, Ni, Cu, Graphite (C) etc

Vacuum Pumps: Mechanical Pump: 1x300m³/hr

Holding Pump:1x60m³/hr

Roots Pump: 1x300L/S

Turbo Molecular pump: 2x3500L/S

Gas System: MFC for reactive gas and inert working gas

Protective System: HMI program with Multiple Self-Lock design

Operation & Control System: PLC + Touch Screen

Cooling System: Recycle Cooling water

Heating System: Heaters with PDI thermal couple

Max. Power Consumption 130KW Approx.

Average Power Consumption 70KW Approx.
 
Layout 
 
 
Insite
 

Built Time: 2020

Location: Shanghai, China
 

 
 
Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.