EMI Shielding and NCVM coatings, PVD Thermal Evaporation Sputter Coating Machine

Shielding coating used in cell phone case Cu Copper PVD Thermal Evaporation Coater, Copper Sputtering Deposition System

RTEP1616-SPDC   PVD copper vacuum metallizing machine consist of  thermal evaporation and sputtering deposition sources, vacuum coating chamber , vacuum pumping system, deposition system, cooling system , electrical control system , workpiece rotating rack.  

Thermal Evaporation and Sputtering Metalizing Machine Features:

Dual chamber for independent loading operations.
Four types of coating process modes available for selection.
Option: RF generators or magnetron sputtering source can be installed for surface coating.
Uses planetary rotation mechanism to achieve good film uniformity on curved surface substrates.

Thermal Evaporation and Sputtering Metalizing Machine Application:

Plastic cutlery, Ceramic, Electronics product, Cellphone housing, NCVM applications, Decorative items, Metallic finish.
Coating Function:Protective coating, functional coating.
Film: Copper conductive film, Metal film, semi-transparent film, Mobile phone EMI, NCVM, Dielectric film.
Substrates:plastic parts, construction material, atrs&craft, electronics products etc

Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.