Hot Melt Adhesive Tape Adhesive for attaching Chip Modules on PC and PVC Substrates
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Hot Melt Adhesive Tape Adhesive for attaching Chip Modules on PC and PVC Substrates
Description: The hot melt adhesive is used for embedding of contact smart cards. Excellent adhesion to PVC, PC, FR-4 and other materials.This product belongs to hot-melt tape with low and medium temperature properties. Very strong cohesion and good flexibility to ensure that no structural fracture will occur in the thrust and bending tests after bonding, while maintaining a balanced bond strength with the chip and the card base, and has excellent punchability. Meet the requirements of ISO7816 standard for chip package fastness.
Applications: DS-4 is suitable for heat embedding of IC cards, SIM cards, financial social security cards, and contact bank cards. Composition: Polyamide synthetic modification
Physical Characteristics:
Recommended Bonding Conditions:
Applications:
Customer Feedback:
Smart Cards India Expo 2018
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Product Tags: hot melt adhesive film thermal adhesive tape |
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