Polyamide Hot Melt Film Adhesive Conductive Tape For Smart Card Chip Bonding
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Factory Hot Melt Film Adhesive Conductive Tape For Chip Bonding Of Smart Card
Description:
This hot melt adhesive film is applied to the encapsulation of the
contact smart card. It has excellent adhesion to PVC, ABS, PC, FR-4
materials. And aim at the damage to chip moudule due to high heat
in the card-based laser bar code manufacture process , it can
insulate the heat and avoide the thermal damage of module.
Product Image:
Composition: Polyamide synthesis modification Physical Characteristics:
Recommended Bonding Conditions:
Detailed Images:
Applications: |
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| Product Tags: hot melt adhesive film pressure sensitive adhesive tape |
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