White Translucent Hot Melt Adhesive Tape Adhesive Attaching Chip Modules On PC / PVC Substratesn
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Hot Melt Adhesive Tape Adhesive for attaching Chip Modules on PC and PVC Substrates
Physical Characteristics:
The hot melt adhesive is used in the encapsulation of contact smart card. Excellent adhesion to PVC, ABS, PC, FR-4 and other materials.
Quick detail:
This product belongs to large molecular weight structure type hot melt adhesive tape. The super-strong cohesive force ensures that the thrust and bending tests after bonding will not show any structural fracture while maintaining a balanced bond strength with the chip and the base. In line with ISO7816 standard for chip packaging fastness.
Applications:
1, Bonding temperature and pressure as well as the time involved in
the strength of the film to material. Bonding temperature must be
close to the machine set the temperature, the pressure must be
uniform, mold and pressure roller must be flat. Customer Feedback:
Smart Cards India Expo 2018
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| Product Tags: hot melt adhesive film thermal adhesive tape | ||||||||||||||||||||||||||||||||
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