PCB Separator Laser Peeling Machine Printed Circuit Board UV Cutting

Characteristics

1. High precision: the combination of low drift galvanometer and fast coreless linear motor system platform enables fast cutting while maintaining micron precision.
2. Simple and easy to learn: Independently developed control software based on Windows system, easy to operate Chinese interface, friendly and beautiful, powerful and diverse functions, simple and convenient operation.
3. Intelligent automaticity: using high-precision CCD automatic positioning and focusing, positioning fast and accurate, without manual intervention, simple operation, to achieve the same type of one-button mode, greatly improve production efficiency. The galvanometer automatic correction, automatic focusing, the whole process of automation, using the laser displacement sensor automatically adjust the focus to the height of the table, to achieve fast alignment, time and worry.
4. Suitable for cutting objects: FPC circuit board shape, chip cutting, mobile phone camera module.
Block, layer, designated block or selected area cutting and directly molding, cutting edge neat and smooth, no burr, no glue overflow. The products can be arranged in multiple matrix for automatic positioning cutting, especially suitable for cutting fine, difficult, complex patterns and other shapes
5. High performance laser: the brand solid state UV laser, with good beam quality, small focusing spot, uniform power distribution, small thermal effect, small slit width, good cutting quality is the guarantee of cutting quality.

The advantages of laser splitter
1. No stress: special vehicle with laser processing, even if the components are very close to the cutting path, there is no stress effect;
2. Accurate thermal effect control: according to different thermal effect requirements, select the appropriate type of laser, with the appropriate laser processing parameters, minimize the thermal effect;
3. Clean processing: real-time laser dust processing during processing, minimize the impact of dust on circuit components;
4. Multi-function: suitable for all kinds of thickness of soft plate, hard plate, soft and hard combined board precision cutting drilling, also suitable for other materials such as: glass, ceramics, thin metal plate and other materials cutting drilling;
5. Safety: the processing area is completely closed to ensure the safety protection of the processing process; Comply with Chinese and Eu electrical standard design;
6. Automation: Reserved open ports, suitable for all kinds of automation needs;
7. High speed and high precision: motion control system with coaxial CCD positioning system to ensure high speed and high precision in machining process;
8. High degree of freedom: a variety of nanosecond, picosecond uv and green laser for choice, to meet different processing needs;
9. Simple and quick operation: compatible with a variety of software formats, simple operation, quick to use;
10. Power detection system: optional power online detection system, to ensure power stability, save the consistency of cutting quality.