Our manufacturing covers the photovoltaic value chain from ingot
casting and wafering through solar cell production and solar panel
assembly.All the cell is with most strict quality standard in every
production process .
Features:
1.High conversion efficiency resulting in superior power output
performance.
2.Outstanding power output even in low light or high temperature
conditions
3.Optimized design for ease of soldering and lamination
4.Long-term stability,reliability and performance
5.Output power tolerance of +/-3%
Physical characteristics:
Dimension:156*156mm±0.5mm
Thickness:Wafer(si):200μm±20μm
Cell:240μm±40μm
Front:Silver bus bars;Dark blue/others silicon nitride anti
reflection coating
Back:Silver/aluminum bus bars;Full-surface aluminum BSF
Temperature Coefficients,
TkVoltage:-0.348%/K;
TkCurrent:+0.031%/K
TkPower:-0.46%/K
Data under standard testing conditions(STC):1000W/Sq.M, AM1.5, 25ºC
No. | Ef ciency(%) | Pmpp(W) | Umpp(V) | Impp(A) | Uoc(V) | Isc(A) | FF(%) |
12 | 18.50-19.00 | 4.5 | 0.541 | 8.321 | 0.643 | 8.857 | 79.05 |
11 | 18.40-18.50 | 4.48 | 0.54 | 8.293 | 0.642 | 8.831 | 78.97 |
10 | 18.30-18.40 | 4.46 | 0.539 | 8.274 | 0.641 | 8.811 | 78.92 |
9 | 18.20-18.30 | 4.43 | 0.537 | 8.242 | 0.64 | 8.778 | 78.87 |
8 | 18.10-18.20 | 4.41 | 0.536 | 8.221 | 0.638 | 8.757 | 78.82 |
7 | 18.00-18.10 | 4.38 | 0.535 | 8.193 | 0.637 | 8.73 | 78.75 |
6 | 17.90-18.00 | 4.36 | 0.533 | 8.171 | 0.636 | 8.71 | 78.67 |
5 | 17.80-17.90 | 4.33 | 0.532 | 8.149 | 0.635 | 8.691 | 78.57 |
4 | 17.70-17.80 | 4.31 | 0.53 | 8.128 | 0.633 | 8.672 | 78.47 |
3 | 17.60-17.70 | 4.29 | 0.529 | 8.106 | 0.632 | 8.65 | 78.4 |
2 | 17.50-17.60 | 4.26 | 0.527 | 8.079 | 0.631 | 8.626 | 78.3 |
1 | 17.40-17.50 | 4.24 | 0.526 | 8.053 | 0.629 | 8.601 | 78.25 |
Typical package for one box is 1200 cells. These cells are sealed
in paper boards every 100 pcs.
Gross weight per unit shall be around 15 kg.
Solar Cell Production Line
Cleaning & Texturing: Wafers are cleaned with industrial soaps and form square-based
pyramids also called texture. The texturization helps to reduce the
reflection of sunlight.
Diffusion: Wafers that have been pre-droped with boron during the casting
process are then given a negative(n-type) surface characteristic by
diffusing them with a phosphorus source at high temperature, which
in turn creats the negative/positive(n-p) junction.
Etching: Phosphorus diffuses not only into the desired wafer surface but
also into the side and the opposite surface to form PN. This gives
a shunt path between the cell front and rear. Removal of the path
around the wafer edge/edge junction isolation is named etching.
PECVD: By PECVD equipment, the wafers are coated with anti-reflection
coating(ARC). It's the blue silicion nitride film to reduce
reflection and promote absorption of light.
Printing & Heating: it was adopted by printing paste with screen technology to print
the electrodes of silicion solar, and form a good ohmic contact.
Testing & Sorting: It means classifying the cells according to their efficiency
tested under the simulated sunlight.
