XP win7 Automatic Solder Paste Printer for SMT Large-Scale
Applications Introduction GLE Automatic solder paste printing machine is a high-end machine
for SMT large-scale applications. The width of Gts is only 2830mm.
It can perfectly meet the printing process requirements of
01005,0.3pitch and other fine spacing, it's high precision and high
speed. Specification | Model | GLE | | Max PCB Size | 510x510mm | | Min PCB size | 50x50mm | | PCB thickness | 0.4-6mm | | Max board weight | 5kg | | Transport height | 900±40mm | | Board edge gap | 2.5mm | | Board height | 23mm | | Transport direction | L-R,R-L | | Transport speed | max 1500mm/s, program control | | Transport method | One stage | | WIdth adjustment | automatic | | I/O interface | SMEMA | | PCB positioning (support method) | Magnetic pin/support block/up-down table | | PCB clamping system | Patented over the top clamping | | Side clamping | | Adsorption function | | Print snap-off | 0-20mm | | Print mode | one/twice | | Print Speed | 10-200mm/sec | | Print Mode | One /Twice | | Squeegee Type | Rubber /steel Squeegee Blade(Angle 45°/55°/60°) | | Print pressure | 0.5-10kg | | Template fram size | 470*370mm~737*737mm | | Cleaning System | Droops of rain type cleaning system | | Reinforced vacuum absorption | | Dry, wet vacuum three modes | | CCD FOV | 10x8mm | | Fiducial mark types | Standard Fiducial mark shape | | Pad | | Hole | | Camera system | Look up/down optics structure | | CCD digital camera | | Geometry pattern match |
Machine Performance | Model | GLE | | Repeat position accuracy | ±12.5um@6,CPK≥2.0 | | Print accuracy | ±20um@6,CPK≥2.0 | | Print cycle time | ＜7.5 sec | | Based on the third party test system(CTQ) verify the actual solder
paste printing position repeat precision |
Whole Machine Specification | Power supply | AC:220±10%,50/60HZ, 3.0KW | | Air pressure | 4~6 kgf/cm² | | Air consumption | around 5L/min | | Operating temperature | -20℃~+45℃ | | Operating humidity | 30%~60% | | Machine Dimensions(without tower light) | 1240(L) x 1410(W) x 1500 (H)mm | | Machine Weight | Approx: around 1100Kg |
Features - GKG special adjustment jacking platform. Stable and easy to adjust,
it can quicklyadjust the pin jacking height of PCB with different
thickness.
- Cleaning system: GKG cleaning system equipped with three cleaning
methods: dry cleaning, wet cleaning, vacuum. which can be combined
to use. It can also be cleaned by manual if customer do not need to
use automatic cleaning to reduce the cleaning time and improve
production efficiency. The newly wiping system ensures full contact
with the stencil, increased vacuum suction can effectively
eliminate the remaining paste in the mesh, which can achieve
effective automatic cleaning function.CCD part and c leaning system
is separated, when CCD working, CCD part independently move to
reduce the servo motor load and improve the machine speed and
accuracy.
- Image and optical system. Using uniform ring light and high
brightness coaxial light, with promise brightness adjustment
function, then all types of Mark points can be well recognized
(Including the rugged mark points), applicable for tin plating,
coppering, gold plating,tin spraying, FPC and other types PCB with
of different colors. With GKG patent mathematical model,able to
ensure high accuracy.
- High adaptability steel mesh frame clamping system. Able to print
all kinds of size screen frames, and quickly change modular
production line.
- Using Windows XP/win7 operation interface, with good man-machine
dialogue function, and easy for operator quickly familiar with the
operation especially when doing navigation effect of programming
file. easy to switch Chinese/English interface, with operation log,
fault record / fault self-diagnosis / fault analysis prompt / light
alarm and other functions.
- New Pattern guide rail ban detachable, programmable flexible side
clamp, specific to FPC, PCB warpage, perform a unique clamping
plate device. Through software programming can automatically
stretch out and draw back unaffected PCB pickness.
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