AI Processors AI Servers Thermal Pad With Thermal Conductivity Of 16.0W/mK For Electronics Cooling And Heat Dissipation
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AI Processors AI Servers Thermal Pad With Thermal Conductivity Of 16.0W/mK For Electronics Cooling And Heat DissipationProducts description The TIF®800TS Series is a high-end compressible thermal pad that meets top-level cooling requirements while also ensuring excellent assembly workability. Through an innovative material formulation, it successfully achieves an ideal combination of ultra-high thermal conductivity and moderate hardness. This unique performance balance allows it to efficiently handle the cooling challenges posed by extremely high heat fluxes, while also possessing good mechanical _strength and compressibility, making it easy, to manufacture and install. It provides a thermal interface material solution with both outstanding heat dissipation performance and high reliability for high-power-density electronic devices. Features > Good thermal conductive 16.0W/mK > Moldability for complex parts > Soft and compressible for low stress applications > Naturally tacky needing no further adhesive coating > Available in varies thicknesses Applications > Photovoltaic > Signal communication > New energy vehicle > Motherboard chip > Radiator > AI Processors AI Servers > Semiconductor Packaging > Low-Altitude Aircraft > Optical Communication Products > 5G Base Stations Key attributes
Product Specifications Standard Thickness: 0.030" (0.75 mm)~0.200" (5.00 mm) with
increments of 0.010" (0.25 mm)
Packaging Details & Lead time The packaging of thermal pad 1.with PET film or foam-for protection 2. use Paper Card To Separate Each Layer 3. export carton inside and outside 4. meet with customers' requirement-customized Lead Time :Quantity(Pieces):5000 Est. Time(days): To be negotiated Company profile Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in
the research, development, production and sales of thermal
interface materials. We mainly produce: heat-conducting joint
filler, low melting point thermal interface materials,
heat-conducting insulator, heat-conducting adhesive tape,
heat-conducting interface pad and heat-conducting grease,
heat-conducting plastic, silicone rubber, silicone rubber foam,
etc. We adhere to the business philosophy of "survival by quality,
development by quality", and continue to provide the most efficient
and best service for new and old customers with excellent quality
in the spirit of rigor, pragmatism and innovation. Factory Size:8000~10,000 square meters Factory Country/Region:No.12, Xiju Road, Hengli Township, Dongguan
City, Guangdong Province, P.R.China Online-service : 12 hours , Inquiry reply within fastest. Well-trained & experienced staff are to answer all your inquiries in English of course. Standard Export Carton Or Marked With Customer's Information Or Customized. Provide free samples After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof. we will help you to deal with it and give you satisfactory solution. Ziitek Culture Quality : Do it right the first time, total quality control Effectiveness: Work precisely and thoroughly for effectiveness Service: Quick response, On time delivery and Excellent service Team work: Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers. |
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AI Processors AI Servers Thermal Pad With Thermal Conductivity Of 16.0W/mK For Electronics Cooling And Heat Dissipation |
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