Blue Thermal Gap Filler Silicone Rubber Pads Providing Effective Thermal Management Solutions For Telecommunication Equipment
|
Blue Thermal Gap Filler Silicone Rubber Pads Providing Effective Thermal Management Solutions For Telecommunication EquipmentCompany ProfileDongguan Ziitek Electronic Material and Technology Ltd. (ZIITEK) has been deeply involved in the field of heat conducting materials for many years, and is a high-tech enterprise integrating R&D, production and sales. Headquartered in Dongguan, with four production bases in Kunshan, Taiwan Province and Viet Nam, the global delivery capacity is stable and reliable. Mainly engaged in thermal conductive silica pads, thermal conductive graphite sheets, thermal conductive insulation materials, PCM phase change materials, thermal conductive plastics, thermal conductive silicone grease/paste, thermal conductive gel, thermal conductive epoxy potting glue, thermal conductive silicone adhesive, silicone foam, and silicon-free thermal pads. The core explosive heating plate is widely recognized by the market. Our products have passed ISO9001 and IATF16949 certification, and meet RoHS/UL standards, and are widely used in new energy, 5G, data center, automotive electronics and other fields. Products description The TIF®100-50-05S Series is a well-balanced,general-purpose thermal pad.It offers high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance. Features > Good thermal conductive 6.5W/mK > Broad range of hardnesses available > Outstanding thermal performance > Easy release construction > Electrically isolating > High durability Applications > Cooling components to the chassis of frame > High speed mass storage drives > Heat Sinking Housing at LED-lit BLU in LCD > LED TV and LED-lit lamps > RDRAM memory modules > Micro heat pipe thermal solutions > Power tools > Network communication products > Electric vehicle batteries > Computer CPU/GPU Cooling > New energy vehicle power systems Key attributes
Product Specifications Standard Thickness:0.010" (0.25 mm)～0.200" (5.00 mm) with
increments of 0.010" (0.25 mm). Component Codes: The TIF®series is available in custom shapes and various forms. Packaging Details & Lead time The packaging of thermal pad 1.with PET film or foam-for protection 2. use Paper Card To Separate Each Layer 3. export carton inside and outside 4. meet with customers' requirement-customized Lead Time :Quantity(Pieces):5000 Est. Time(days): To be negotiated Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''. 2.Our core competencies is thermal conductive interface materials. 3.Competitive advantage products. 4.Condidentiality agreement Bussiness Secrect Contract. 5.Free sample offer. 6.Quality assurance contract.
FAQ
Q: Are you trading company or manufacturer ? A: We are manufacturer in China. Q: What thermal conductivity test method was used to achieve the values given on the data sheets? A: A test fixture is utilized that meets the specifications outlined in ASTM D5470. Q: Is GAP PAD offered with an adhesive? A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Thermal Gap Pad Materials 1.5W Thermally Conductive Gap Filler Pads For AI Processors AI Servers Heat Dissipation |
|
Thermal Gap Filler Offering Thermal Conductivity 1.5W/mK For In Electronic Device Heat Management |
|
Blue Thermal Gap Filler Silicone Rubber Pads Providing Effective Thermal Management Solutions For Telecommunication Equipment |
|
High Reliability And Stability Thermal Conductive Gap Filler Pads Ideal For Heat Dissipation In Electronic And Industrial Equipment |
|
Dark Gray Thermal Gap Filler Silicone Pads With 5.0W/mK High Thermal Conductivity For Effective Heat Transfer In Telecommunication Hardware |
|
Silicone Thermal Pad Thermal Interface Gap Filler Pads for Enhanced Heat Dissipation in Electronic Industrial Components |