Heat Transfer CPU Thermal Pad With 3.2W/MK Thermal Conductive Gap Pad Suitable For Portable Electronics And Industrial Equipment
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Heat Transfer CPU Thermal Pad With 3.2W/MK Thermal Conductive Gap Pad Suitable For Portable Electronics And Industrial Equipment
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect! Products description TIF®100-32-05S Series is awell-balanced,general-purpose thermal pad.It
offers good thermal conductivity_and moderate hardness. This
balanced design provides both excellent surface conformity and
superior ease of use,making it capable of effectively
transferring heat and providing basic physical protection
for a wide range of electronic components.It is an ideal
choice for addressing medium to high power heat dissipation
needs, achieving the best balance between cost and
performance. Features > Good thermal conductive: 3.2W/mK > Moldability for complex parts > Soft and compressible for low stress applications > Naturally tacky needing no further adhesive coating > Available in varies thicknesses > Broad range of hardnesses available Applications > Power tools Key attributes
Product Specifications Standard Thickness:0.010" (0.25 mm)～0.200" (5.00 mm) with
increments of 0.010" (0.25 mm). Component Codes: The TIF®series is available in custom shapes and various forms. Our services
Online-service : 12 hours , Inquiry reply within fastest.
Well-trained & experienced staff are to answer all your inquiries in English of course. Standard Export Carton Or Marked With Customer's Information Or Customized. Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof. we will help you to deal with it and give you satisfactory solution.
FAQ: Q: What thermal conductivity test method was used to achieve the values given on the data sheets? A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive? A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.
Q: Are you trading company or manufacturer ? A: We are manufacturer in China. |
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Heat Transfer CPU Thermal Pad With 3.2W/MK Thermal Conductive Gap Pad Suitable For Portable Electronics And Industrial Equipment |
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