Dark Gray Thermal Gap Filler Silicone Pads With 5.0W/mK High Thermal Conductivity For Effective Heat Transfer In Telecommunication Hardware
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Dark Gray Thermal Gap Filler Silicone Pads With 5.0W/mK High Thermal Conductivity For Effective Heat Transfer In Telecommunication HardwareCompany ProfileDongguan Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect! Products description The TIF®100-50-11F Series is a structurally supportive thermal pad designed to provide high heat dissipation while also ensuring structural support and durability. It can reliably fill interface gaps, transfer heat, and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation,insulation, and mechanical stability. Features > Good thermal conductive 6.5W/mK > Broad range of hardnesses available > Outstanding thermal performance > Available in varies thicknesses > Outstanding thermal performance > Soft and compressible for low stress applications Applications > Cooling components to the chassis of frame > High speed mass storage drives > CPU > Display card > Mainboard/mother board > Notebook > Power supply > Heat pipe thermal solutions > Memory Modules > Mass storage devices > Automotive electronics > Set top boxes > Audio and video component Key attributes
Product Specifications Standard Thickness:0.010" (0.25 mm)～0.200" (5.00 mm) with
increments of 0.010" (0.25 mm). Component Codes: The TIF®series is available in custom shapes and various forms. Packaging Details & Lead time The packaging of thermal pad 1.with PET film or foam-for protection 2. use Paper Card To Separate Each Layer 3. export carton inside and outside 4. meet with customers' requirement-customized Lead Time :Quantity(Pieces):5000 Est. Time(days): To be negotiated Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''. 2.Our core competencies is thermal conductive interface materials. 3.Competitive advantage products. 4.Condidentiality agreement Bussiness Secrect Contract. 5.Free sample offer. 6.Quality assurance contract.
FAQ
Q: Are you trading company or manufacturer ? A: We are manufacturer in China. Q: How do I request customized samples? A: To request samples, you can leave us message on website, or just contact us by send email or call us. Q: What's the thermal conductivity test method given on the data sheet ? A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity. Q: How to find a right thermal conductivity for my applications A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials. |
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Dark Gray Thermal Gap Filler Silicone Pads With 5.0W/mK High Thermal Conductivity For Effective Heat Transfer In Telecommunication Hardware |
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Silicone Thermal Pad Thermal Interface Gap Filler Pads for Enhanced Heat Dissipation in Electronic Industrial Components |