Silicone Thermal Pad Thermal Interface Gap Filler Pads for Enhanced Heat Dissipation in Electronic Industrial Components
|
Silicone Thermal Pad Thermal Interface Gap Filler Pads for Enhanced Heat Dissipation in Electronic Industrial ComponentsCompany ProfileZiitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant. Products descriptionTIF®100-30-10S Series is a well-balanced,general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance. Features > Good thermal conductive > Moldability for complex parts > Broad range of hardnesses available > Outstanding thermal performance > High tack surface reduces contact resistance > RoHS compliant > UL recognized Applications > Embedded Motherboard > Industrial visual inspection equipment > Graphics card cooling module > Charging pile power module > Central control screen > Power tools > Network communication products > Electric vehicle batteries > Computer CPU/GPU Cooling > New energy vehicle power systems
Key attributes
Product Specifications Standard Thickness:0.010" (0.25 mm)～0.200" (5.00 mm) with
increments of 0.010" (0.25 mm). Component Codes: The TIF®series is available in custom shapes and various forms. Packaging Details & Lead time The packaging of thermal pad 1.with PET film or foam-for protection 2. use Paper Card To Separate Each Layer 3. export carton inside and outside 4. meet with customers' requirement-customized Lead Time :Quantity(Pieces):5000 Est. Time(days): To be negotiated Ziitek Culture
Quality : Do it right the first time, total quality control Effectiveness: Work precisely and thoroughly for effectiveness Service: Quick response, On time delivery and Excellent service Team work: Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
FAQ
Q: What thermal conductivity test method was used to achieve the values given on the data sheets? A: A test fixture is utilized that meets the specifications outlined in ASTM D5470. Q: Is GAP PAD offered with an adhesive? A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.
Q: What's the thermal conductivity test method given on the data sheet ? A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity. Q: How to find a right thermal conductivity for my applications A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials. |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Thermal Gap Filler Offering Thermal Conductivity 1.5W/mK For In Electronic Device Heat Management |
|
Blue Thermal Gap Filler Silicone Rubber Pads Providing Effective Thermal Management Solutions For Telecommunication Equipment |
|
High Reliability And Stability Thermal Conductive Gap Filler Pads Ideal For Heat Dissipation In Electronic And Industrial Equipment |
|
Dark Gray Thermal Gap Filler Silicone Pads With 5.0W/mK High Thermal Conductivity For Effective Heat Transfer In Telecommunication Hardware |
|
Silicone Thermal Pad Thermal Interface Gap Filler Pads for Enhanced Heat Dissipation in Electronic Industrial Components |
|
Silicone Thermal Pad Thermal Conductive Gap Filler Pads Designed For Heat Dissipation In Electronic And Industrial Fields |