Silicone Thermal Pad Thermal Conductive Gap Filler Pads Designed For Heat Dissipation In Electronic And Industrial Fields
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Silicone Thermal Pad Thermal Conductive Gap Filler Pads Designed For Heat Dissipation In Electronic And Industrial FieldsCompany ProfileDongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation. Products descriptionTIF®100-20-10S Series is a well-balanced,general-purpose thermal pad.It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. Features >Good thermal conductive >Moldability for complex parts >Soft and compressible for low stress applications >Naturally tacky needing no further adhesive coating >Available in varies thicknesses Applications >Embedded Motherboard >Industrial visual inspection equipment >Graphics card cooling module >Charging pile power module >Central control screen >Home appliance industry >Power module >Wearable device >Solar photovoltaic panel >LED lighting fixtures
Key attributes
Product Specifications Standard Thickness:0.010" (0.25 mm)～0.200" (5.00 mm) with
increments of 0.010" (0.25 mm). Component Codes: The TIF®series is available in custom shapes and various forms. Packaging Details & Lead time The packaging of thermal pad 1.with PET film or foam-for protection 2. use Paper Card To Separate Each Layer 3. export carton inside and outside 4. meet with customers' requirement-customized Lead Time :Quantity(Pieces):5000 Est. Time(days): To be negotiated Our services
Online-service : 12 hours , Inquiry reply within fastest.
Well-trained & experienced staff are to answer all your inquiries in English of course. Standard Export Carton Or Marked With Customer's Information Or Customized. Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof. we will help you to deal with it and give you satisfactory solution.
FAQ
Q: What thermal conductivity test method was used to achieve the values given on the data sheets? A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive? A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.
Q: How do I place an order? A:1. Click the "Sent messages" button to continue with the process. 2. Fill out the message form by entering a subject line, and message to us. This message should include any questions you might have about the products as well as your purchase requests. 3. Click the "Send" button when you are finished to complete the process and send your message to us 4. We will reply you as soon as possible with Email or online
Q: How do I request customized samples? A: To request samples, you can leave us message on website, or just contact us by send email or call us. |
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Silicone Thermal Pad Thermal Conductive Gap Filler Pads Designed For Heat Dissipation In Electronic And Industrial Fields |