Ultra Low Volatility Of Siloxane Silicone Thermally Conductive Gap Filler Pads For Central Control Screen
|
|
Ultra Low Volatility Of Siloxane Silicone Thermally Conductive Gap Filler Pads For Central Control Screen
Ziitek Technology Company is dedicated to providing a comprehensive range of thermal management products and services to meet various demand scenarios. Ziitek Technology offers prompt and flexible services. Our thermal conductive materials are widely used in the fields of new energy, electronic appliances, transportation, industry, healthcare, communication, etc. Ziitek has obtained ISO9001, ISO14001 and IECQ certifications, which indicate our commitment to producing high-quality products and adopting excellent management methods. Our products comply with RoHS, REACH and UL standards, ensuring safety and reliability. Products description The TIF®100L 2050-06 eries is a thermal pad with ultra-lowsiliconoxygen volatilization, designed specifically for optical and high-precision applications. Its soft and elastic material can fill the uneven gaps between heating elements and heat sinks or metal bases, limprove thermal conductivity efficiency,and effectively extend the life of electronic components. The silicone structure filled with ceramics not only has good thermal conductivity, but also has extremely low volatility of low molecular weight siloxanes, which can significantly reduce the risk of internal contamination in optical devices.
Features >Ultra low volatility of siloxane >Good thermal conductivity >Self adhesive without the need for extermal surface adhesive >Highly compressible,easy to install and operate >Good insulation performance Applications >Embedded Motherboard
Product Specifications
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Well-trained & experienced staff are to answer all your inquiries in English of course. Standard Export Carton Or Marked With Customer's Information Or Customized. Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof. we will help you to deal with it and give you satisfactory solution.
FAQ
Q:How can we get detailed price list? A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.
Q: What thermal conductivity test method was used to achieve the values given on the data sheets? A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive? A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements. |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
AI Processors AI Servers Thermal Pad With Thermal Conductivity Of 16.0W/mK For Electronics Cooling And Heat Dissipation |
|
Thermal Gap Filler Designed To Provide Thermal Conductivity Of 2.0W/mK For Electronics Cooling Applications |
|
|
Soft Silicone Base Thermal Pad 1.5W/mK Thermal Conductivity For In UAV And Electronic Assemblies |
|
Green 1.8W/mK Thermal Gap Filler For Unmanned Aerial Vehicle UAV |
|
Heat Transfer CPU Thermal Pad With 3.2W/MK Thermal Conductive Gap Pad Suitable For Portable Electronics And Industrial Equipment |
|
|
Thermal Gap Filler 6.0W/mK Silicone Thermal Pad Designed For Heat Transfer And Reduced Thermal Resistance In Electronic Devices |
