Dongguan Ziitek Electronical Material and Technology Ltd.: Dongguan Ziitek Electronical Material and Technology, Ltd. Professional TIM Manufacturer

Home > Products > CPU Thermal Pad >

Electronic Components Thermal Silicone Gap Filling Cooling Pad Thermal Absorbing Conductive Insulating Pad For AI Servers

Browse Categories

Silicone Thermal Pad(230)
Heat Sink Thermal Pad(192)
CPU Thermal Pad(258)
Thermal Graphite Sheet(29)
Thermally Conductive Electrical Insulator(37)
PCM Phase Change Material(28)
Double Sided Thermal Tape(22)
Heat Conductive Plastic(10)
High Temperature Thermal Grease(19)
Thermally Conductive Potting Compound(12)
Thermal Epoxy Glue(9)
Thermal Conductive Silicone Adhesive(4)
Thermal Conductive Gel(25)
Shielding Absorbing Materials(22)
Silicone Foam Sheet(8)
Silicone Free Thermal Pad(9)
Most Popular Products(11)
Film Heating Element(6)

Dongguan Ziitek Electronical Material and Technology Ltd.

City: dongguan

Province/State:guangdong

Country/Region:china

Tel:+86-18153789196

Contact Person:
Ms.Dana Dai View Contact Details

Electronic Components Thermal Silicone Gap Filling Cooling Pad Thermal Absorbing Conductive Insulating Pad For AI Servers

Brand Name	Ziitek
Model Number	TIF100-18-56E
Certification	UL
Place of Origin	China
Minimum Order Quantity	1000 pcs
Price	0.1-10 USD/PCS
Payment Terms	T/T
Supply Ability	100000pcs/month
Delivery Time	3-8 work days
Packaging Details	241312cm carton
Products name	Electronic Components Thermal Silicone Gap Filling Cooling Pad Thermal Absorbing Conductive Insulating Pad For AI Servers
Hardness	65/35 shore00
Keywords	Thermal gap cooliong pad
Color	Green
Material	Ceramic filled silicon material
Thermal conductive	1.8 W/mK
Thickness	0.010"(0.25mm)~0.200"(5.0mm)
Density	2.3g/cm³
Application	Electronic Components cooling

Detailed Product Description

Electronic Components Thermal Silicone Gap Filling Cooling Pad Thermal Absorbing Conductive Insulating Pad For AI Servers

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

The TIF^®100-18-56E Series is a well-balanced,general-purpose thermal pad.It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.

Features

> Good thermal conductive 1.8W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses

Applications

> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes

> Home appliance industry
> Power module
> Wearable device
> Solar photovoltaic panel
> LED lighting fixtures

Typical Properties of TIF^®100-18-56E Series
Property	Value		Test method
Color	Green		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	2.3		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.00)
Hardness	65 Shore 00	35 Shore 00	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	4.5 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity	1.8 W/m-K		ASTM D5470
	1.8 W/m-K		ISO22007

Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mmX406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

FAQ

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Related Products

AI Processors AI Servers Thermal Pad With Thermal Conductivity Of 16.0W/mK For Electronics Cooling And Heat Dissipation for sale

Heat Transfer CPU Thermal Pad With 3.2W/MK Thermal Conductive Gap Pad Suitable For Portable Electronics And Industrial Equipment

Thermal Gap Filler 6.0W/mK Silicone Thermal Pad Designed For Heat Transfer And Reduced Thermal Resistance In Electronic Devices

Email to this supplier


From:	Enter your Email please. Your email is incorrect!
To:	Dongguan Ziitek Electronical Material and Technology Ltd.
Subject:	Subject is empty!
Message:	Characters Remaining: (80/3000) Please enter 20 to 3000 characters to contact this supplier!

Electronic Components Thermal Silicone Gap Filling Cooling Pad Thermal Absorbing Conductive Insulating Pad For AI Servers

Electronic Components Thermal Silicone Gap Filling Cooling Pad Thermal Absorbing Conductive Insulating Pad For AI Servers

AI Processors AI Servers Thermal Pad With Thermal Conductivity Of 16.0W/mK For Electronics Cooling And Heat Dissipation

Thermal Gap Filler Designed To Provide Thermal Conductivity Of 2.0W/mK For Electronics Cooling Applications

Soft Silicone Base Thermal Pad 1.5W/mK Thermal Conductivity For In UAV And Electronic Assemblies

Green 1.8W/mK Thermal Gap Filler For Unmanned Aerial Vehicle UAV

Heat Transfer CPU Thermal Pad With 3.2W/MK Thermal Conductive Gap Pad Suitable For Portable Electronics And Industrial Equipment

Thermal Gap Filler 6.0W/mK Silicone Thermal Pad Designed For Heat Transfer And Reduced Thermal Resistance In Electronic Devices