High Dielectric Strength Silicone-Based Gap Pad Filler For Consumer Electronics Cooling
|
|
High Dielectric Strength Silicone-Based Gap Pad Filler For Consumer Electronics Cooling
The TIF®100-15-11S Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
> Easy release construction
Product Specifications Standard Thickness: 0.010" (0.25 mm)～0.200" (5.00 mm) with increments of 0.010" (0.25 mm). Standard Size: 16" X16" (406 mm X406 mm). Component Codes: Reinforcement Fabric: FG (Fiberglass). Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening). Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive). The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us. Advantage
Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.
Independent R&D team
Q: How do I place an order? A:1. Click the "Sent messages" button to continue with the process. 2. Fill out the message form by entering a subject line, and message to us. This message should include any questions you might have about the products as well as your purchase requests. 3. Click the "Send" button when you are finished to complete the process and send your message to us. 4. We will reply you as soon as possible with Email or online. |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Custom Size Thicknesses Thermal Pad 1.8W/MK Thermal Management Materials For AI Processors AI Servers |
|
UL94 V-0 Compliant 1.5W/MK Thermal Management Silicone Pads With Good Insulation Performance |
|
High Dielectric Strength Silicone-Based Gap Pad Filler For Consumer Electronics Cooling |
|
High Thermally Conductive 15W/MK Gray Thermally Gap Pads For 5G Base Stations |
|
Low Compression Stress 6.5W Soft Thermal GAP PAD Materials For AI Processors AI Servers |
|
High Performance Silicone-Based Ultra-Soft Thermally Conductive Sheet For Electronic Products Energy Storage Industrial |