Low Compression Stress 6.5W Soft Thermal GAP PAD Materials For AI Processors AI Servers
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Low Compression Stress 6.5W Soft Thermal GAP PAD Materials For AI Processors AI Servers
Company Profile
The TIF®700NS Series a well-balanced, general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness. This balanced design provides both good surface conformity and excellent ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.
Features
> Good thermal conductive
Applications
Product Specification
Component Codes:
The TIF® series is available in custom shapes and various forms. Ziitek Culture
Quality : Do it right the first time, total quality control Effectiveness: Work precisely and thoroughly for effectiveness Service: Quick response, On time delivery and Excellent service Team work: Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
FAQ:
Q: What thermal conductivity test method was used to achieve the values given on the data sheets? A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive? A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.
Q: Are you trading company or manufacturer ? A: We are manufacturer in China.
Q: How long is your delivery time? A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost? A: Yes, we could offer samples free of charge. |
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| Product Tags: low compression stress thermal pad soft thermal gap pad for AI processors silicone thermal pad for AI servers | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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