Exceptional Thermal Conductivity Rating Of 10.0W/M-K Silicone-Based Thermal Gap Pad Filler For AI Processors AI Servers
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Exceptional Thermal Conductivity Rating Of 10.0W/M-K Silicone-Based Thermal Gap Pad Filler For AI Processors AI Servers
Company Profile
Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
The TIF®100-65-11U Series is designed for high performance applications and provides excellent wet-out at the interface, due to its exceptional conformity to rough or irregular surfaces. The soft gap pad filler material is supplied with a protective liner on both sides for ease of use, and the unique filler package and low modulus design offer high thermal performance at low pressures.
> Thermal conductivity: 6.5W/m-K Applications > Cooling components to the chassis of frame > High speed mass storage drives > Heat Sinking Housing at LED-lit BLU in LCD > LED TV and LED-lit lamps > RDRAM memory modules > Micro heat pipe thermal solutions > Automotive engine control units > Telecommunication hardware > Handheld portable electronics > Semiconductor automated test equipment (ATE) > Signal communication > New energy vehicle > Motherboard chip > Radiator > AI Processors AI Servers > CPU > Display card > Mainboard/mother board
Component Codes:
The TIF® series is available in custom shapes and various forms. Ziitek Culture
Quality : Do it right the first time, total quality control Effectiveness: Work precisely and thoroughly for effectiveness Service: Quick response, On time delivery and Excellent service Team work: Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
FAQ:
Q: Are you trading company or manufacturer ? A: We are manufacturer in China.
Q: Do you provide samples ? is it free or extra cost? A: Yes, we could offer samples free of charge.
Q: What thermal conductivity test method was used to achieve the values given on the data sheets? A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive? A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements. |
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| Product Tags: silicone thermal gap pad filler high thermal conductivity AI processor pad thermal pad for AI servers | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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