UL Compliant Good Insulation Performance Ultra-Soft Thermally Conductive Gap Filler Pads For AI Processors AI Servers
|
|
Extremely Soft 6.5W/M-K Thermal Conductive Silica Gap Pad For Telecom Equipment
Company Profile Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:Thermal gap padThermal graphite sheet/filmThermal double-sided tapeThermal insulation padThermal greasePhase change materialThermal gelAll products are compliant with UL94 V-0, SGS and ROHS standards.Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, ULProduct introduction
TIF®100-40-11E Series is a wellbalanced, general-purpose thermal pad. It offers high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.
Features
> Good softness and fillability
Applications
> Power tools > Signal communication
Product Specifications
Packaging Details & Lead time
The packaging of thermal pad 1.with PET film or foam-for protection 2. use Paper Card To Separate Each Layer 3. export carton inside and outside 4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000 Est. Time(days): To be negotiated
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''. 2.Our core competencies is thermal conductive interface materials. 3.Competitive advantage products. 4.Condidentiality agreement Bussiness Secrect Contract. 5.Free sample offer. 6.Quality assurance contract.
FAQ:
Q: Are you trading company or manufacturer ? A: We are manufacturer in China.
Q: What thermal conductivity test method was used to achieve the values given on the data sheets? A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive? A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements. |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Product Tags: UL compliant thermal gap filler pads ultra-soft CPU thermal pads thermally conductive AI server pads | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
UL And RoHs Certificated High Conductivity 3W Self Adhesive Thermal Gap Pad For Computer CPU/GPU Cooling |
|
UL Compliant Good Insulation Performance Ultra-Soft Thermally Conductive Gap Filler Pads For AI Processors AI Servers |
|
Good Insulation Performance Ultra-Soft 6.5W Thermally Gap Pad For AI Server Computer CPU GPU Cooling |
|
3.0W Ultra Soft Thermal Pad With Hardness 12 Shore00 High-Performance Silicone Gap Pads For Electronic Components |
|
3.0W High Temperature Silicone Thermal Gap Pad For Network Communication Products Laptop CPU/GPU Cooling |
|
2.8W Electronic Components AI Server Thermal Pads 0.5mm High Quality Thermal Conductivity Insulated Pad |