3.0W Ultra Soft Thermal Pad With Hardness 12 Shore00 High-Performance Silicone Gap Pads For Electronic Components
|
|
3.0W Ultra Soft Thermal Pad With Hardness 12 Shore00 High-Performance Silicone Gap Pads For Electronic Components
Company Profile
A silicone thermal pad is a type of thermal interface material (TIM) which is highly conductive and comprises of conformable materials which are used to provide a heat path between heat sinks and electronic devices where uneven surface topography, air gaps and texture preclude good thermal transfer. Ziitek supply a wide range of silicone thermal pads with varying properties to suit every application.
Certifications: ISO9001:2015 ISO14001: 2004 IATF16949:2016 IECQ QC 080000:2017 UL
Product introduction
TIF®500-30-11ES Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments sensitive to extreme mechanical stress. It combines higt thermal conductivity with a near-fluid ultimate softness, ensuring perfect filling of the contact interface even under ultra-low mounting pressure,completely eliminating air thermal resistance,and providing superior thermal solutions and physical protection for the most precise and higt heat flux electronic components.
Features:
> High thermal conductivity > Low compression stress effectively protects sensitive
components
Electronic components, 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
Product Specifications Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm) Standard Size: 16"X 16" (406 mm×406 mm) Component Codes: Reinforcement Fabric: FG (Fiberglass). Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening). Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive). The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad 1.with PET film or foam-for protection 2. use Paper Card To Separate Each Layer 3. export carton inside and outside 4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000 Est. Time(days): To be negotiated Our services
Online-service : 12 hours , Inquiry reply within fastest.
Well-trained & experienced staff are to answer all your inquiries in English of course. Standard Export Carton Or Marked With Customer's Information Or Customized. Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof. we will help you to deal with it and give you satisfactory solution.
FAQ
Q: Are you trading company or manufacturer ? A: We are manufacturer in China.
Q: What's the thermal conductivity test method given on the data sheet ? A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for my applications A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials. |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Product Tags: 3.0W Ultra Soft Thermal Pad High-Performance Silicone Gap Pads CPU Thermal Pad 12 Shore00 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
UL And RoHs Certificated High Conductivity 3W Self Adhesive Thermal Gap Pad For Computer CPU/GPU Cooling |
|
UL Compliant Good Insulation Performance Ultra-Soft Thermally Conductive Gap Filler Pads For AI Processors AI Servers |
|
Good Insulation Performance Ultra-Soft 6.5W Thermally Gap Pad For AI Server Computer CPU GPU Cooling |
|
3.0W Ultra Soft Thermal Pad With Hardness 12 Shore00 High-Performance Silicone Gap Pads For Electronic Components |
|
3.0W High Temperature Silicone Thermal Gap Pad For Network Communication Products Laptop CPU/GPU Cooling |
|
2.8W Electronic Components AI Server Thermal Pads 0.5mm High Quality Thermal Conductivity Insulated Pad |