China Silicone Thermal Pad manufacturer
Dongguan Ziitek Electronical Material and Technology Ltd.
Dongguan Ziitek Electronical Material and Technology, Ltd. Professional TIM Manufacturer
8
Home > Products > CPU Thermal Pad >

8.5W/mK Silicone Thermal Pad for GPU CPU LED -40~200℃

8.5W/mK Silicone Thermal Pad for GPU CPU LED -40~200℃

Brand Name Ziitek
Model Number TIF700RES
Certification UL & RoHS
Place of Origin China
Minimum Order Quantity 1000pcs
Price 0.1-10 USD/PCS
Payment Terms T/T
Supply Ability 1000000 pcs/month
Delivery Time 3-5 work days
Packaging Details 24*13*12cm cartons
Products name High Temperature 8.5W Custom Silicone Gap Filler Electric Thermal Pads For Gpu Cpu Led
Application Gpu Cpu Led
Thickness 0.04~0.12inch / 1.0~3.0mm
Specific Gravity 3.5g/cc
Dielectric Breakdown Voltage >5000 VAC
Thermal conductivity 8.5W/m-K
Color Gray
Operating Temp -40~200℃
Keywords Silicone Thermal Pads
Detailed Product Description

High Temperature 8.5W Custom Silicone Gap Filler Electric Thermal Pads For Gpu Cpu Led

 

Company Profile

 

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Product introduction

 

TIF®700RES Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

 

Features


> Excellent thermal conductivity: 8.5 W/mK
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options

> Easy release construction
> Electrically isolating

 

Applications


> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED TV and lamps

> Display card
> Mainboard/mother board
> Notebook
> Power supply

Typical Properties of  TIF®700RES Series
PropertyValueTest method
ColorGrayVisual
Construction &CompostionCeramic filled silicone elastomer***
Thickness range0.04~0.12inch / 1.0~3.0mmASTM D374
Hardness10 Shore 00ASTM 2240
Specific Gravity3.5 g/ccASTM D792
Continuos Use Temp-40 to 200℃Ziitek Test Method
Dielectric Breakdown Voltage≥5000 VACASTM D149
Dielectric Constant6.7 MHzASTM D150
Volume Resistivity≥1.0X1012Ohm-meterASTM D257
Fire rating94 V0UL E331100
Thermal conductivity8.5W/m-KASTM D5470

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

 

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

Product Tags: 8.5W/mK silicone thermal pad   GPU CPU thermal pad with warranty   high-performance thermal pad for LED  
Related Products
Email to this supplier
 
From:
Enter your Email please.
To: Dongguan Ziitek Electronical Material and Technology Ltd.
Subject:
Message:
Characters Remaining: (80/3000)