Soft 3.0W Thermal Conductive Silicone Pad With Various Thermal Conductivity
|
|
Soft 3.0W Thermal Conductive Silicone Pad With Various Thermal Conductivity
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Certifications: ISO9001:2015 ISO14001: 2004 IATF16949:2016 IECQ QC 080000:2017 UL
TS-TIF®100C 3030-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases.lts flexibility and elasticity make it ideal for covering highly uneven surfaces.With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures, thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.
Features: > Self-adhesive without the need for additional surface adhesive > Available in various thicknesses > Easy release construction
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Product Specification Product Thicknesses: 0.012"(0.30mm)-0.200"(5.00mm) Product Sizes:8" x 16"(203mm x406mm) Custom die-cut shapes and thicknesses are available.Please contact us for details. Store in a cool, dry place, away from fire and sunlight. Packaging Details & Lead time
The packaging of thermal pad 1.with PET film or foam-for protection 2. use Paper Card To Separate Each Layer 3. export carton inside and outside 4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000 Est. Time(days): To be negotiated.
FAQ: Q: Are you trading company or manufacturer ? A: We are manufacturer in China. Q: How long is your delivery time? A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity. Q: Do you offer free samples ? A: Yes, we are willing to offer free sample.
Ziitek Culture
Quality : Do it right the first time, total quality control Effectiveness: Work precisely and thoroughly for effectiveness Service: Quick response, On time delivery and Excellent service Team work: Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers. |
||||||||||||||||||||||||||||||||||||
| Product Tags: 3.0W Thermal Conductive Silicone Pad Various Thermal Conductivity Silicone Pad Soft Thermal Conductive Silicone Pad | ||||||||||||||||||||||||||||||||||||
|
High Performance1.8W Thermal Conductive Pad Sheet For Heat Silicone Thermal Heating Pad For Telecommunication Equipment |
|
Electric Thermal Pad Silica Gap Filler Thermal Pad With Durable Silicone Material |
|
2.0mm Thermal Conductive Silicone Pad 2.6W/mK for Heat-Sink GPU |
|
Premium Soft 2.6W Silicone Thermal Pad Self Adhesive Thermal Filler Pad For Advanced Cooling Needs |
|
Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB Silicone Thermal Pad GPU SSD Thermal Pad |
|
High Thermal Conductivity Customizable Thickness Soft Thermal Pad For CPU GPU Cooling Specific Gravity 2.7g/cm3 |