High Thermal Conductive Carbon Fibre Based Thermal Pad For 5G Communication Equipment

High Thermal Conductive Carbon Fibre Based Thermal Pad For 5G Communication Equipment
 

Company profile

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Products introduction
TS-TIR^®700-09 Series series is a high-performance carbon-based thermal pad that combines highly thermally conductive carbon fiber with polymer silicone materials. Utilizing advanced manufacturing processes to precisely distribute thermal pathways, it achievese xceptional thermal conductivity, effectively reducing interfacial thermal resistance and enhancing heat dissipation efficiency. With its ultra-thin, lightweight design and mechanical flexibility, it is suitable for 5G equipment, high-performance chips, and other high heat flux applications.

Feature

>Good thermal conductivity 9w/mK

>Ultra-low thermal resistance
>works under low pressure.

>Non-insulating material

>Non-adhesive surface

Application

>Between chips and heat dissipation modules

>5G communication equipment
>Optoelectronics industry

>wearable devices